between electrically conductive surfaces

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H01L2224/81895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81895between electrically conductive surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for preparing same
- Patent number 12,100,680
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,040,308
- Issue date Jul 16, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional memory device and fabrication method thereof
- Patent number 11,728,326
- Issue date Aug 15, 2023
- Yangtze Memory Technologies Co., Ltd.
- Ziqi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified direct bond interconnect for FPAs
- Patent number 11,670,616
- Issue date Jun 6, 2023
- EPIR, INC.
- Sushant Sonde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, package structure, and manufacturing metho...
- Patent number 11,456,251
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device bonding structure and fabrication method thereof
- Patent number 11,424,216
- Issue date Aug 23, 2022
- Unimicron Technology Corp.
- Chia-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and fabrication method thereof
- Patent number 11,410,983
- Issue date Aug 9, 2022
- Yangtze Memory Technologies Co., Ltd.
- Ziqi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered substrate with embedded mirror
- Patent number 11,251,321
- Issue date Feb 15, 2022
- Soitec
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,205,602
- Issue date Dec 21, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold-welded flip chip interconnect structure
- Patent number 11,165,010
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,964,666
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked imaging device with Cu-Cu bonding portion
- Patent number 10,917,602
- Issue date Feb 9, 2021
- Sony Corporation
- Yasunori Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
- Publication number 20240387491
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347510
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICE
- Publication number 20240047396
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230238346
- Publication date Jul 27, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Luguang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230223371
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Luguang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
- Publication number 20230126956
- Publication date Apr 27, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230130929
- Publication date Apr 27, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230025936
- Publication date Jan 26, 2023
- National Yang Ming Chiao Tung University
- Han-Wen HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20220384332
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS
- Publication number 20220115354
- Publication date Apr 14, 2022
- FLIR Commercial Systems, Inc.
- Richard E. BORNFREUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE BONDING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220068872
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Chia-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified Direct Bond Interconnect for FPAs
- Publication number 20220052020
- Publication date Feb 17, 2022
- Sushant Sonde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...
- Publication number 20210367112
- Publication date Nov 25, 2021
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS

between electrically conductive surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for preparing same

Method of manufacturing a semiconductor device

Structure and method of forming a joint assembly

Packaged die and RDL with bonding structures therebetween

Solderless interconnection structure and method of forming same

Seal ring structures and methods of forming same

Wafer level packaging of light emitting diodes (LEDs)

Method of room temperature covalent bonding

Three-dimensional memory device and fabrication method thereof

Thermocompression bond tips and related apparatus and methods

Modified direct bond interconnect for FPAs

Packaged die and RDL with bonding structures therebetween

Bonding element and method for manufacturing the same

Semiconductor structure, package structure, and manufacturing metho...

Hybrid interconnect for laser bonding using nanoporous metal tips

Electronic device bonding structure and fabrication method thereof

Three-dimensional memory device and fabrication method thereof

Structure and method of forming a joint assembly

Seal ring structures and methods of forming same

Engineered substrate with embedded mirror

Semiconductor device and manufacturing method thereof

Mixed hybrid bonding structures and methods of forming the same

Cold-welded flip chip interconnect structure

3D packaging with low-force thermocompression bonding of oxidizable...

Method for manufacturing interconnect structure

Solderless interconnection structure and method of forming same

Thermocompression bond tips and related apparatus and methods

Packaged die and RDL with bonding structures therebetween

Chip on package structure and method

Stacked imaging device with Cu-Cu bonding portion

Patents Applicationslast 30 patents

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Structure and Method of Forming a Joint Assembly

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

BONDED SEMICONDUCTOR DEVICE

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

METHOD FOR MANUFACTURING A THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHO...

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS

ELECTRONIC DEVICE BONDING STRUCTURE AND FABRICATION METHOD THEREOF

Modified Direct Bond Interconnect for FPAs

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal