Membership
Tour
Register
Log in
between electrically insulating surfaces
Follow
Industry
CPC
H01L2224/85898
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/85898
between electrically insulating surfaces
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
9,972,598
Issue date
May 15, 2018
Renesas Electronics Corporation
Yuki Yagyu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180082977
Publication date
Mar 22, 2018
RENESAS ELECTRONICS CORPORATION
Yuki YAGYU
H01 - BASIC ELECTRIC ELEMENTS