Bipolar Junction Transistor [BJT]

Industry

CPC
H01L2924/1305

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1305Bipolar Junction Transistor [BJT]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,308,305
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,300,569
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Masanori Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,289,048
- Issue date Apr 29, 2025
- Denso Corporation
- Ryota Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,767
- Issue date Apr 29, 2025
- Denso Corporation
- Hideki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip design and method of controlling clip position
- Patent number 12,283,562
- Issue date Apr 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 12,283,573
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage-controlled switching device with resistive path
- Patent number 12,266,680
- Issue date Apr 1, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Christian Philipp Sandow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
- Patent number 12,230,614
- Issue date Feb 18, 2025
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor, and method for manufacturing optical sensor
- Patent number 12,230,618
- Issue date Feb 18, 2025
- Rohm Co., Ltd.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250183205
- Publication date Jun 5, 2025
- WIN SEMICONDUCTORS CORP.
- Shao-Yu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250183816
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Tatsuya FUKASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
- Publication number 20250157857
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...
- Publication number 20250149506
- Publication date May 8, 2025
- Kirill Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH A CIRCUIT CARRIER
- Publication number 20250140663
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
- Publication number 20250118636
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Manufacturing Semiconductor Pa...
- Publication number 20250112109
- Publication date Apr 3, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko Bernardoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250107126
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Tomohiro TANIGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096169
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20250096159
- Publication date Mar 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
- Publication number 20250098551
- Publication date Mar 20, 2025
- Ambature Inc.
- Douglas J. GILBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087575
- Publication date Mar 13, 2025
- Fuji Electric Co., Ltd.
- Mariko Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...
- Publication number 20250087561
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Martial Duchamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079280
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- WEI-CHUNG CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250062272
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250062271
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Bipolar Junction Transistor [BJT]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Switching device and electronic circuit

Power semiconductor device

Semiconductor package system and related methods

Solder material

Semiconductor device

Semiconductor module and method for manufacturing semiconductor module

Semiconductor device and method for manufacturing the same

Semiconductor module

Semiconductor device

Clip design and method of controlling clip position

Semiconductor power module

Leadframe spacer for double-sided power module

3D semiconductor memory device and structure with memory and metal...

Low warpage high density trench capacitor

Voltage-controlled switching device with resistive path

Embedded package with electrically isolating dielectric liner

Electronic device with multi-layer contact and system

3D semiconductor device and structure with metal layers and memory...

Multi-typed integrated passive device (IPD) components and devices...

Semiconductor device and method of forming micro interconnect struc...

Optical sensor, and method for manufacturing optical sensor

Chip assembling on adhesion layer or dielectric layer, extending be...

Semiconductor device with improved performance in operation and imp...

Semiconductor device and method of manufacturing the same

Transient liquid phase bonding compositions and power electronics a...

Packaging structure of power semiconductor module

3D semiconductor devices and structures with metal layers

Silicon nitride circuit board and electronic component module

Semiconductor device including surface pressure absorbing member fo...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

POWER MODULE WITH A CIRCUIT CARRIER

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

INTELLIGENT POWER MODULE ARRANGEMENT

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

SEMICONDUCTOR DEVICE

Semiconductor Package and Method for Manufacturing Semiconductor Pa...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...

SEMICONDUCTOR DEVICE

POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE