Bismuth [Bi] as principal constituent

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H01L2224/29413

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29413Bismuth [Bi] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive adhesive, light emitting device, and method...
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- Issue date Nov 8, 2016
- Dexerials Corporation
- Hidetsugu Namiki
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Information Patent Grant
High conductivity, high strength, lead-free, low cost, electrically...
- Patent number 6,238,599
- Issue date May 29, 2001
- International Business Machines Corporation
- Jeffrey Donald Gelorme
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Information Patent Grant
Thermally conducting materials and applications for microelectronic...
- Patent number 6,114,413
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of fabricating coated powder materials and their use for hig...
- Patent number 6,059,952
- Issue date May 9, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS
- Publication number 20020005247
- Publication date Jan 17, 2002
- TERESITA ORDONEZ GRAHAM
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