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Bismuth (Bi) as principal constituent
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H01L2224/48813
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/48813
Bismuth (Bi) as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device including an insulating film and insulating pi...
Patent number
7,675,183
Issue date
Mar 9, 2010
Kabushiki Kaisha Toshiba
Hiroshi Toyoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with improved bonding
Patent number
6,727,593
Issue date
Apr 27, 2004
Kabushiki Kaisha Toshiba
Hiroshi Toyoda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor device and manufacturing method of semiconductor device
Publication number
20080237863
Publication date
Oct 2, 2008
Kabushiki Kaisha Tosiba
Hiroshi Toyoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solderability Improvement Method for Leaded Semiconductor Package
Publication number
20080006937
Publication date
Jan 10, 2008
TEXAS INSTRUMENTS INCORPORATED
Akira Matsunami
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
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Patent Application
Semiconductor device and manufacturing method of semiconductor device
Publication number
20060113674
Publication date
Jun 1, 2006
Kabushiki Kaisha Toshiba
Hiroshi Toyoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and manufacturing method of semiconductor device
Publication number
20040159951
Publication date
Aug 19, 2004
Kabushiki Kaisha Toshiba
Hiroshi Toyoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and manufacturing method of semiconductor device
Publication number
20020121703
Publication date
Sep 5, 2002
KABUSHI KAISHA TOSHIBA
Hiroshi Toyoda
H01 - BASIC ELECTRIC ELEMENTS