TREA

Bismuth (Bi) as principal constituent

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  • CPC
  • H01L2224/45613
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45613Bismuth (Bi) as principal constituent
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BALL-BOND ARRANGEMENT
    • Publication number 20250015037
    • Publication date Jan 9, 2025
    • Heraeus Materials Singapore Pte. Ltd.
    • Yee Weon LIM
    • H01 - BASIC ELECTRIC ELEMENTS