Bismuth [Bi] as principal constituent

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CPC
H01L2224/29213

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29213Bismuth [Bi] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal member made of plurality of metal layers between two heat...
- Patent number 11,710,709
- Issue date Jul 25, 2023
- Denso Corporation
- Ryoichi Kaizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure and bonding material
- Patent number 11,515,281
- Issue date Nov 29, 2022
- Panasonic Holdings Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,069,643
- Issue date Jul 20, 2021
- Fuji Electric Co., Ltd.
- Kenshi Kai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing anisotropic conductive adhesive including...
- Patent number 10,854,572
- Issue date Dec 1, 2020
- NOPION.CO.LTD
- Kyung Sub Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount structure including two members that are bonded to each other...
- Patent number 10,170,442
- Issue date Jan 1, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated composite made up of an electronic substrate and a layer...
- Patent number 9,630,379
- Issue date Apr 25, 2017
- Robert Bosch GmbH
- Thomas Kalich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,691,377
- Issue date Apr 8, 2014
- Panasonic Corporation
- Taichi Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230130647
- Publication date Apr 27, 2023
- DENSO CORPORATION
- Tetsuto YAMAGISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Diffusion Soldering with Contaminant Protection
- Publication number 20220084981
- Publication date Mar 17, 2022
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...
- Publication number 20210129245
- Publication date May 6, 2021
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL
- Publication number 20200373269
- Publication date Nov 26, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
- Publication number 20200335470
- Publication date Oct 22, 2020
- PANASONIC CORPORATION
- Akio FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200098717
- Publication date Mar 26, 2020
- Fuji Electric Co., Ltd.
- Kenshi KAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE INCLUDING...
- Publication number 20200010740
- Publication date Jan 9, 2020
- NOPION.CO.LTD
- Kyung Sub LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL
- Publication number 20190172810
- Publication date Jun 6, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT STRUCTURE
- Publication number 20180166411
- Publication date Jun 14, 2018
- Panasonic Intellectual Property Management Co., Lt
- KIYOHIRO HINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
LAMINATED COMPOSITE MADE UP OF AN ELECTRONIC SUBSTRATE AND A LAYER...
- Publication number 20140248505
- Publication date Sep 4, 2014
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPR...
- Publication number 20140234649
- Publication date Aug 21, 2014
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120018890
- Publication date Jan 26, 2012
- PANASONIC CORPORATION
- Taichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Bismuth [Bi] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diffusion soldering with contaminant protection

Terminal member made of plurality of metal layers between two heat...

Diffusion soldering with contaminant protection

Bonded structure and bonding material

Semiconductor device manufacturing method

Method for manufacturing anisotropic conductive adhesive including...

Low-temperature bonding with spaced nanorods and eutectic alloys

Mount structure including two members that are bonded to each other...

Laminated composite made up of an electronic substrate and a layer...

Joint material, and jointed body

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Diffusion Soldering with Contaminant Protection

METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...

JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL

BONDED STRUCTURE AND BONDING MATERIAL

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE INCLUDING...

JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL

MOUNT STRUCTURE

Joint Material, and Jointed Body

LAMINATED COMPOSITE MADE UP OF AN ELECTRONIC SUBSTRATE AND A LAYER...

LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPR...

SEMICONDUCTOR DEVICE