Bismuth [Bi] as principal constituent

Industry

CPC
H01L2224/13213

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13213Bismuth [Bi] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing a chip-card module with soldered electron...
- Patent number 11,894,295
- Issue date Feb 6, 2024
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion soldering preform with varying surface profile
- Patent number 11,764,185
- Issue date Sep 19, 2023
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting structure, and combination of semico...
- Patent number 11,444,054
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
- Publication number 20230065738
- Publication date Mar 2, 2023
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Manufacturing a Chip-Card Module with Soldered Electron...
- Publication number 20220139818
- Publication date May 5, 2022
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...
- Publication number 20200273837
- Publication date Aug 27, 2020
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...
- Publication number 20190229098
- Publication date Jul 25, 2019
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS

Bismuth [Bi] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for manufacturing a chip-card module with soldered electron...

Diffusion soldering preform with varying surface profile

Semiconductor element mounting structure, and combination of semico...

Low temperature solder in a photonic device

Lead free solder columns and methods for making same

Solder and electrically conductive adhesive based interconnection f...

Patents Applicationslast 30 patents

DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE

Process for Manufacturing a Chip-Card Module with Soldered Electron...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...