Bismuth [Bi] as principal constituent

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H01L2224/13613

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13613Bismuth [Bi] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy diffusion barrier layer
- Patent number 10,424,552
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including bump
- Patent number 10,157,873
- Issue date Dec 18, 2018
- SK hynix Inc.
- Jun-Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visibility event navigation method and system
- Patent number 9,916,763
- Issue date Mar 13, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. Jenkins
- G05 - CONTROLLING REGULATING
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-package and methods of manufacturing semiconductor package and...
- Patent number 9,761,477
- Issue date Sep 12, 2017
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 9,620,469
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 9,269,683
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,117,811
- Issue date Aug 25, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including through-silicon-vias having in...
- Patent number 8,987,869
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 8,766,439
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method for manufacturing the same, and mount...
- Patent number 8,330,271
- Issue date Dec 11, 2012
- Kyocera Corporation
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metal bumps
- Patent number 7,550,375
- Issue date Jun 23, 2009
- Advanced Semiconductor Engineering Inc.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,495,441
- Issue date Dec 17, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,344,690
- Issue date Feb 5, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,333,554
- Issue date Dec 25, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking semiconductor devices, particularly memory chips
- Patent number 5,998,864
- Issue date Dec 7, 1999
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...
- Publication number 20240038707
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Mechanisms for Forming Post-Passivation Interconnect Structure
- Publication number 20190326241
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20190236964
- Publication date Aug 1, 2019
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMP
- Publication number 20180366430
- Publication date Dec 20, 2018
- SK HYNIX INC.
- Jun-Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20180268724
- Publication date Sep 20, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G08 - SIGNALLING
Information Patent Application
PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...
- Publication number 20170025302
- Publication date Jan 26, 2017
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, SEMICONDUCTOR-MOUNTED PRODUCT INCLUDING TH...
- Publication number 20160035688
- Publication date Feb 4, 2016
- YASUO FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20140187034
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING THROUGH-SILICON-VIAS HAVING IN...
- Publication number 20130175673
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL COATING FOR INDIUM BUMP BONDING
- Publication number 20110315429
- Publication date Dec 29, 2011
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20110140271
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Element, Method for Manufacturing the Same, and Mount...
- Publication number 20100252926
- Publication date Oct 7, 2010
- KYOCERA CORPORATION
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming metal bumps
- Publication number 20070218676
- Publication date Sep 20, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder bump structure for flip chip package and method for manufact...
- Publication number 20070205512
- Publication date Sep 6, 2007
- In-Young Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder bump structure for flip chip package and method for manufact...
- Publication number 20050127508
- Publication date Jun 16, 2005
- In-Young Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device with gold bumps, and method and apparatus of p...
- Publication number 20020100972
- Publication date Aug 1, 2002
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS

Bismuth [Bi] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Semiconductor device with a heterogeneous solder joint and method f...

Multi-chip package and manufacturing method thereof

Package structure and method for connecting components

Mechanisms for forming post-passivation interconnect structure

Expanded head pillar for bump bonds

Alloy diffusion barrier layer

Core material, semiconductor package, and forming method of bump el...

Mechanisms for forming post-passivation interconnect structure

Semiconductor package including bump

Visibility event navigation method and system

Sintered conductive matrix material on wire bond

Semiconductor device and method of forming bump structure with insu...

Pre-package and methods of manufacturing semiconductor package and...

Bump electrode, board which has bump electrodes, and method for man...

Mechanisms for forming post-passivation interconnect structure

Flip chip assembly and process with sintering material on metal bumps

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Metal coating for indium bump bonding

Flip chip assembly and process with sintering material on metal bumps

Integrated circuit devices including through-silicon-vias having in...

Semiconductor device and method of forming bump structure with insu...

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Electroconductive bonding material, method for bonding conductor, a...

Semiconductor element, method for manufacturing the same, and mount...

Method for forming metal bumps

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Stacking semiconductor devices, particularly memory chips

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...

SEMICONDUCTOR PACKAGE

Light-Emitting Device and Displayer

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

EXPANDED HEAD PILLAR FOR BUMP BONDS

ALLOY DIFFUSION BARRIER LAYER

Mechanisms for Forming Post-Passivation Interconnect Structure

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

ALLOY DIFFUSION BARRIER LAYER

SEMICONDUCTOR PACKAGE INCLUDING BUMP

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR-MOUNTED PRODUCT INCLUDING TH...

Semiconductor Device and Method of Forming Bump Structure with Insu...

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...

INTEGRATED CIRCUIT DEVICES INCLUDING THROUGH-SILICON-VIAS HAVING IN...

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

Semiconductor Device and Method of Forming Bump Structure with Insu...

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

METAL COATING FOR INDIUM BUMP BONDING

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...

Semiconductor Element, Method for Manufacturing the Same, and Mount...

Method for forming metal bumps

Solder bump structure for flip chip package and method for manufact...

Solder bump structure for flip chip package and method for manufact...

Semiconductor device with gold bumps, and method and apparatus of p...