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Bismuth (Bi) as principal constituent
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CPC
H01L2224/48613
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/48613
Bismuth (Bi) as principal constituent
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last 30 patents
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Patent Application
Solderability Improvement Method for Leaded Semiconductor Package
Publication number
20080006937
Publication date
Jan 10, 2008
TEXAS INSTRUMENTS INCORPORATED
Akira Matsunami
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...