TREA

Bismuth [Bi] as principal constituent

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  • CPC
  • H01L2224/29613
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29613Bismuth [Bi] as principal constituent
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Patents Grantslast 30 patents

  • Information Patent Grant

    Methods for bonding substrates
    • Patent number 11,309,278
    • Issue date Apr 19, 2022
    • Applied Materials, Inc.
    • Prayudi Lianto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHODS FOR BONDING SUBSTRATES
    • Publication number 20200135690
    • Publication date Apr 30, 2020
    • Applied Materials, Inc.
    • PRAYUDI LIANTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR