Bismuth [Bi]

Industry

CPC
H01L2924/01083

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01083Bismuth [Bi]

Industries

Patents Grantslast 30 patents

Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a chip-card module with soldered electron...
- Patent number 11,894,295
- Issue date Feb 6, 2024
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BGA STIM package architecture for high performance systems
- Patent number 11,817,364
- Issue date Nov 14, 2023
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering preform with varying surface profile
- Patent number 11,764,185
- Issue date Sep 19, 2023
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,705,413
- Issue date Jul 18, 2023
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform diffusion soldering
- Patent number 11,605,608
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 11,600,588
- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure and bonding material
- Patent number 11,515,281
- Issue date Nov 29, 2022
- Panasonic Holdings Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,413,709
- Issue date Aug 16, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct attachment of capacitors to flip chip dies
- Patent number 11,404,365
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,854
- Issue date Apr 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,302,657
- Issue date Apr 12, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,229,979
- Issue date Jan 25, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,227,846
- Issue date Jan 18, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for packaging component
- Patent number 11,101,239
- Issue date Aug 24, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,069,643
- Issue date Jul 20, 2021
- Fuji Electric Co., Ltd.
- Kenshi Kai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,643,848
- Issue date May 5, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,629,439
- Issue date Apr 21, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting method of circuit member
- Patent number 10,464,153
- Issue date Nov 5, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 10,252,363
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20240065002
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
- Publication number 20240030086
- Publication date Jan 25, 2024
- Intel Corporation
- Rajasekaran SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20230197679
- Publication date Jun 22, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
- Publication number 20230130092
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
- Publication number 20230065738
- Publication date Mar 2, 2023
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20220331913
- Publication date Oct 20, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220285297
- Publication date Sep 8, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Manufacturing a Chip-Card Module with Soldered Electron...
- Publication number 20220139818
- Publication date May 5, 2022
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220102297
- Publication date Mar 31, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
- Publication number 20220077099
- Publication date Mar 10, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Gwang-Mun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preform Diffusion Soldering
- Publication number 20210143120
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...
- Publication number 20210129245
- Publication date May 6, 2021
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066158
- Publication date Mar 4, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES
- Publication number 20200357737
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
- Publication number 20200335470
- Publication date Oct 22, 2020
- PANASONIC CORPORATION
- Akio FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PACKAGING COMPONENT
- Publication number 20200258861
- Publication date Aug 13, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Zhibai ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243462
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243464
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200098717
- Publication date Mar 26, 2020
- Fuji Electric Co., Ltd.
- Kenshi KAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20200094353
- Publication date Mar 26, 2020
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bismuth [Bi]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor package having improved thermal interface between sem...

Process for manufacturing a chip-card module with soldered electron...

BGA STIM package architecture for high performance systems

Diffusion soldering preform with varying surface profile

Semiconductor package having improved thermal interface between sem...

Preform diffusion soldering

Superconducting bump bonds for quantum computing systems

Ultrasonic-assisted solder transfer

Bonded structure and bonding material

High reliability lead-free solder alloys for harsh environment elec...

Direct attachment of capacitors to flip chip dies

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package having improved thermal interface between sem...

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor package having improved thermal interface between sem...

Low temperature solder in a photonic device

Process for packaging component

Semiconductor device manufacturing method

Lead free solder columns and methods for making same

Method and apparatus for creating a bond between objects based on f...

Cu column, Cu core column, solder joint, and through-silicon via

Method for minimizing average surface roughness of soft metal layer...

Method for minimizing average surface roughness of soft metal layer...

Method of manufacturing semiconductor device

Connecting method of circuit member

Method of manufacturing cu core ball

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Forming a solder joint between metal layers

Patents Applicationslast 30 patents

Lead-Free Solder Ball

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS

Superconducting Bump Bonds for Quantum Computing Systems

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...

DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

Process for Manufacturing a Chip-Card Module with Soldered Electron...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...

ULTRASONIC-ASSISTED SOLDER TRANSFER

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

Preform Diffusion Soldering

METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES

BONDED STRUCTURE AND BONDING MATERIAL

PROCESS FOR PACKAGING COMPONENT

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...