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H05K2201/09509

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09509Blind vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and method of producing the same
- Patent number 12,185,463
- Issue date Dec 31, 2024
- Nitto Denko Corporation
- Kanayo Sawashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,177,973
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable assembly, signal transmission structure, and electronic device
- Patent number 12,114,425
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,089,325
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Jae Hwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and method for manufacturing same
- Patent number 12,028,990
- Issue date Jul 2, 2024
- STEMCO CO., LTD.
- Sung Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency front-end module, manufacturing method thereof and...
- Patent number 12,022,616
- Issue date Jun 25, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,924,961
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ai Jing Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and display device including the same
- Patent number 11,856,698
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Jongjin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adapter board, method for manufacturing the same and circuit board...
- Patent number 11,856,702
- Issue date Dec 26, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 11,842,958
- Issue date Dec 12, 2023
- Chun-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flexible printed circuit board and display touch apparatus
- Patent number 11,839,018
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Wenxiao Niu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Control device and manufacturing method of control device
- Patent number 11,765,817
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Yutaka Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting and cooling a circuit component
- Patent number 11,764,540
- Issue date Sep 19, 2023
- Landa Labs (2012) Ltd.
- Ronny Costi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 11,737,206
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 11,678,437
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,576,257
- Issue date Feb 7, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- G02 - OPTICS
Information Patent Grant
Circuit board device
- Patent number 11,570,886
- Issue date Jan 31, 2023
- Global Unichip Corporation
- Yu-Ju Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 11,570,904
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...
- Publication number 20250056725
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250008659
- Publication date Jan 2, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS
- Publication number 20240431026
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jaeho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20240404937
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215157
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ran PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240188216
- Publication date Jun 6, 2024
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240090129
- Publication date Mar 14, 2024
- PanelSemi Corporation
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...
- Publication number 20240063110
- Publication date Feb 22, 2024
- CHUN-MING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230397334
- Publication date Dec 7, 2023
- NANJING ZTE NEW SOFTWARE CO., LTD.
- Li ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT
- Publication number 20230352903
- Publication date Nov 2, 2023
- LANDA LABS (2012) LTD.
- Ronny COSTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...
- Publication number 20230292438
- Publication date Sep 14, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun WENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230292428
- Publication date Sep 14, 2023
- Unimicron Technology Corp.
- Ai Jing LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY A...
- Publication number 20230292431
- Publication date Sep 14, 2023
- TTM TECHNOLOGIES, INC.
- Niels Husted Kirkeby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Module
- Publication number 20230269876
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Jong-Hyun SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20230254977
- Publication date Aug 10, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Beveled overburden for vias and method of making the same

Wiring circuit board and method of producing the same

Flexible circuit board and manufacturing method thereof

Printed wiring board

Circuit board and manufacturing method thereof and electronic device

Cable assembly, signal transmission structure, and electronic device

Printed circuit board

Circuit board having laminated build-up layers

Multilayer board and method for manufacturing same

Semiconductor chip module

Radio frequency front-end module, manufacturing method thereof and...

Circuit board preparation method

Circuit board and method of manufacturing the same

Multilayer wiring board and method of producing the same

Structure for embedding and packaging multiple devices by layer and...

Circuit board structure

Circuit board and display device including the same

Adapter board, method for manufacturing the same and circuit board...

Conductive structure including copper-phosphorous alloy and a metho...

Flexible printed circuit board and display touch apparatus

Control device and manufacturing method of control device

Method and apparatus for mounting and cooling a circuit component

Circuit board structure

Component carrier with blind hole filled with an electrically condu...

Manufacturing method of circuit carrier board structure

Semiconductor chip module

Circuit board and method for manufacturing the same

Circuit board

Circuit board device

Method for contacting and rewiring an electronic component embedded...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF CIRCUIT BOARD

CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PRINTED CIRCUIT BOARD

APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS

ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

REDUCED BALL GRID ARRAY PAD CAPACITANCE

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

Component Carrier and Method Manufacturing the Same

ELECTRONIC SYSTEM

MANUFACTURING METHOD OF CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

Structures for Forming Printed Board Interconnects Using Solder

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE

CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...

CIRCUIT BOARD

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT

RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY A...

Semiconductor Chip Module

Component Carrier and Method of Manufacturing the Same