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  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20250193994
    • Publication date Jun 12, 2025
    • LG Innotek Co., Ltd.
    • Won Suk JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250132224
    • Publication date Apr 24, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Chul GONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250126709
    • Publication date Apr 17, 2025
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20250125269
    • Publication date Apr 17, 2025
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER RADIO FREQUENCY COMPONENT

    • Publication number 20250118881
    • Publication date Apr 10, 2025
    • Knowles Cazenovia, Inc.
    • Jared P. Burdick
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE

    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20250081354
    • Publication date Mar 6, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250071902
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD

    • Publication number 20250056712
    • Publication date Feb 13, 2025
    • Unimicron Technology Corp.
    • Jun-Rui Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...

    • Publication number 20250056725
    • Publication date Feb 13, 2025
    • HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
    • Xiao-Juan ZHANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

    • Publication number 20250040036
    • Publication date Jan 30, 2025
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • LI-CHUN HUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

    • Publication number 20250029938
    • Publication date Jan 23, 2025
    • BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Yifan WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250008659
    • Publication date Jan 2, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Heun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS

    • Publication number 20240431026
    • Publication date Dec 26, 2024
    • Samsung Electronics Co., Ltd.
    • Jaeho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

    • Publication number 20240404937
    • Publication date Dec 5, 2024
    • Murata Manufacturing Co., Ltd.
    • Sami NURMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCED BALL GRID ARRAY PAD CAPACITANCE

    • Publication number 20240389220
    • Publication date Nov 21, 2024
    • Dell Products L.P.
    • Sandor FARKAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

    • Publication number 20240389230
    • Publication date Nov 21, 2024
    • NVIDIA Corporation
    • Mingyi Yu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240389231
    • Publication date Nov 21, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240381527
    • Publication date Nov 14, 2024
    • LG Innotek Co., Ltd.
    • Jae Hwa KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

    • Publication number 20240357736
    • Publication date Oct 24, 2024
    • Hitachi Astemo, Ltd.
    • Takanori SEKIGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier and Method Manufacturing the Same

    • Publication number 20240334613
    • Publication date Oct 3, 2024
    • AT&S (Chongqing) Company Limited
    • JyunMin WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC SYSTEM

    • Publication number 20240314920
    • Publication date Sep 19, 2024
    • MEDIATEK INC.
    • Tso-Ju YI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD

    • Publication number 20240282687
    • Publication date Aug 22, 2024
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240215157
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

    • Publication number 20240188216
    • Publication date Jun 6, 2024
    • FICT LIMITED
    • Kenji Iida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Structures for Forming Printed Board Interconnects Using Solder

    • Publication number 20240172372
    • Publication date May 23, 2024
    • Conductor Analysis Technologies, Inc.
    • Timothy A. Estes
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

    • Publication number 20240121897
    • Publication date Apr 11, 2024
    • NXP B.V.
    • Abdellatif Zanati
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

    • Publication number 20240114632
    • Publication date Apr 4, 2024
    • Unimicron Technology Corp.
    • Ming-Hao WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20240090129
    • Publication date Mar 14, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...

    • Publication number 20240063110
    • Publication date Feb 22, 2024
    • CHUN-MING LIN
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR