Block copolymer

Industry

CPC
H01L2924/0645

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0645Block copolymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,282,804
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,510,704
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,304,803
- Issue date May 28, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased source/drain area
- Patent number 10,242,983
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased source/drain area
- Patent number 9,837,407
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced board level reliability for wafer level packages
- Patent number 9,837,368
- Issue date Dec 5, 2017
- Maxim Integrated Products, Inc.
- Peter R. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive die attach film for large die semiconductor packages and...
- Patent number 9,449,938
- Issue date Sep 20, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
DIE AND PACKAGE STRUCTURE
- Publication number 20240203924
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND PACKAGE STRUCTURE
- Publication number 20220208711
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190237423
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INCREASED SOURCE/DRAIN AREA
- Publication number 20180069001
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...
- Publication number 20160099190
- Publication date Apr 7, 2016
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ENHANCED BOARD LEVEL RELIABILITY FOR WAFER LEVEL PACKAGES
- Publication number 20150255413
- Publication date Sep 10, 2015
- Maxim Integrated Products, Inc.
- Peter R. Harper
- H01 - BASIC ELECTRIC ELEMENTS

Block copolymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die and package structure

Package structure and method of manufacturing the same

Nanoscale interconnect array for stacked dies

Package structure and method of manufacturing the same

Nanoscale interconnect array for stacked dies

Semiconductor device with increased source/drain area

Semiconductor device with increased source/drain area

Enhanced board level reliability for wafer level packages

Conductive die attach film for large die semiconductor packages and...

Patents Applicationslast 30 patents

DIE AND PACKAGE STRUCTURE

DIE AND PACKAGE STRUCTURE

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH INCREASED SOURCE/DRAIN AREA

Nanoscale Interconnect Array for Stacked Dies

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...

ENHANCED BOARD LEVEL RELIABILITY FOR WAFER LEVEL PACKAGES