Bombardment with particles

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H01L21/76862

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76862Bombardment with particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,154,826
- Issue date Nov 26, 2024
- Kokusai Electric Corporation
- Masanori Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing memory and memory
- Patent number 12,096,620
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 12,080,594
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug with impurity variation
- Patent number 12,033,893
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including liner structure
- Patent number 12,027,419
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 11,854,878
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug with impurity variation
- Patent number 11,769,694
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,664,275
- Issue date May 30, 2023
- Kokusai Electric Corporation
- Masanori Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping control of metal nitride films
- Patent number 11,587,829
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 11,430,692
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impurity removal in doped ALD tantalum nitride
- Patent number 11,410,881
- Issue date Aug 9, 2022
- Applied Materials, Inc.
- Rui Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact plug with impurity variation
- Patent number 11,404,312
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and formation method thereof
- Patent number 11,393,910
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,384,429
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with landing pad of conductive polymer and met...
- Patent number 11,309,313
- Issue date Apr 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping of metal barrier layers
- Patent number 11,270,911
- Issue date Mar 8, 2022
- Applied Materials Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet radiation activated atomic layer deposition
- Patent number 11,211,244
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing, Co., Ltd.
- Christine Y. Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for forming interconnection structures
- Patent number 11,205,589
- Issue date Dec 21, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 11,177,167
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 11,158,539
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric damage-free dual damascene Cu interconnects without barr...
- Patent number 11,101,172
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cobalt agglomeration resistance and gap-fill performance b...
- Patent number 11,043,415
- Issue date Jun 22, 2021
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient atomic layer deposition
- Patent number 11,043,416
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive features using a vacuum environment
- Patent number 11,004,730
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method for cutting a wafer
- Patent number 10,964,524
- Issue date Mar 30, 2021
- Mitsubishi Electric Corporation
- Tsuyoshi Osaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,916,434
- Issue date Feb 9, 2021
- Lam Research Corporation
- Deqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 10,916,442
- Issue date Feb 9, 2021
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping control of metal nitride films
- Patent number 10,910,263
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20240371685
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Method, Apparatus, and System
- Publication number 20240363405
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Masato SAKAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20240321632
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES
- Publication number 20240304495
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE
- Publication number 20240290655
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Zheng JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20240218503
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED ATMOSPHERIC PLASMA TREATMENT STATION IN PROCESSING TOOL
- Publication number 20240213089
- Publication date Jun 27, 2024
- LAM RESEARCH CORPORATION
- Navaneetha Krishnan SUBBAIYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240079270
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Plug with Impurity Variation
- Publication number 20240021471
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20230307295
- Publication date Sep 28, 2023
- Kokusai Electric Corporation
- Masanori NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION USING GRAPHENE AS AN INHIBITOR
- Publication number 20230245924
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Ieva NARKEVICIUTE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma Etching
- Publication number 20230197457
- Publication date Jun 22, 2023
- SPTS TECHNOLOGIES LIMITED
- ALEX WOOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20230062974
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220367262
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220367263
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...
- Publication number 20220367265
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMORY AND MEMORY
- Publication number 20220328495
- Publication date Oct 13, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yexiao YU
- G11 - INFORMATION STORAGE
Information Patent Application
Impurity Removal in Doped ALD Tantalum Nitride
- Publication number 20220328348
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Rui Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
- Publication number 20220328638
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chiang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20220298625
- Publication date Sep 22, 2022
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRAVIOLET RADIATION ACTIVATED ATOMIC LAYER DEPOSITION
- Publication number 20220199403
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Christine Y. OUYANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20220108919
- Publication date Apr 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
- Publication number 20220084879
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pei-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LANDING PAD OF CONDUCTIVE POLYMER AND MET...
- Publication number 20220051992
- Publication date Feb 17, 2022
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220037203
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impurity Removal in Doped ALD Tantalum Nitride
- Publication number 20210407853
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Rui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20210407852
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF METAL BARRIER LAYERS
- Publication number 20210351072
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Bombardment with particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device, substrate processing...

Method for manufacturing memory and memory

Thermally stable copper-alloy adhesion layer for metal interconnect...

Method and structure for barrier-less plug

Contact plug with impurity variation

Semiconductor device including liner structure

Selective cobalt deposition on copper surfaces

Bi-layer alloy liner for interconnect metallization and methods of...

Contact plug with impurity variation

Method of manufacturing semiconductor device, substrate processing...

Doping control of metal nitride films

Thermally stable copper-alloy adhesion layer for metal interconnect...

Impurity removal in doped ALD tantalum nitride

Contact plug with impurity variation

Semiconductor device and formation method thereof

Selective cobalt deposition on copper surfaces

Semiconductor device with landing pad of conductive polymer and met...

Doping of metal barrier layers

Ultraviolet radiation activated atomic layer deposition

Methods and apparatuses for forming interconnection structures

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Method and structure for barrier-less plug

Dielectric damage-free dual damascene Cu interconnects without barr...

Enhanced cobalt agglomeration resistance and gap-fill performance b...

Gradient atomic layer deposition

Methods of forming conductive features using a vacuum environment

Semiconductor manufacturing method for cutting a wafer

Feature fill with multi-stage nucleation inhibition

Etching method

Doping control of metal nitride films

Patents Applicationslast 30 patents

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

Substrate Processing Method, Apparatus, and System

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES

SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

INTEGRATED ATMOSPHERIC PLASMA TREATMENT STATION IN PROCESSING TOOL

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

Contact Plug with Impurity Variation

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SELECTIVE DEPOSITION USING GRAPHENE AS AN INHIBITOR

Plasma Etching

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Semiconductor Device and Method

Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...

METHOD FOR MANUFACTURING MEMORY AND MEMORY

Impurity Removal in Doped ALD Tantalum Nitride

SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

ULTRAVIOLET RADIATION ACTIVATED ATOMIC LAYER DEPOSITION

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION

SEMICONDUCTOR DEVICE WITH LANDING PAD OF CONDUCTIVE POLYMER AND MET...

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Impurity Removal in Doped ALD Tantalum Nitride

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

DOPING OF METAL BARRIER LAYERS