Bonding areas having different functions

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H01L2224/09515

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09515Bonding areas having different functions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device with bonding electrodes
- Patent number 12,080,666
- Issue date Sep 3, 2024
- Kioxia Corporation
- Hideaki Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,876,067
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,769,747
- Issue date Sep 26, 2023
- Kioxia Corporation
- Genki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power semiconductor module, and power electro...
- Patent number 11,749,578
- Issue date Sep 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,594,506
- Issue date Feb 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment carrier for interconnect bridge assembly
- Patent number 11,393,759
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,257,805
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method of manufacturing the same
- Patent number 11,088,113
- Issue date Aug 10, 2021
- TOSHIBA MEMORY CORPORATION
- Kazutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,930,607
- Issue date Feb 23, 2021
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,522,489
- Issue date Dec 31, 2019
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dual pad wire bond interconnection
- Patent number 10,483,239
- Issue date Nov 19, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 10,388,642
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure having conductive shield
- Patent number 10,276,510
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized solder pads for microelectronic components
- Patent number 10,014,274
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked memory chip having reduced input-output load, memory module...
- Patent number 9,818,707
- Issue date Nov 14, 2017
- Samsung Electronics Co., Ltd.
- Ki-Seok Oh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 9,659,887
- Issue date May 23, 2017
- Lapis Semiconductor Co., Ltd.
- Nobutaka Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with probe pad structure
- Patent number 9,653,427
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having pads
- Patent number 9,595,498
- Issue date Mar 14, 2017
- SK hynix Inc.
- Chang Kun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer pad ring for integrated circuit
- Patent number 9,379,073
- Issue date Jun 28, 2016
- HGST Technologies Santa Ana, Inc.
- Tsan Lin Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 9,299,736
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit package
- Patent number 9,281,254
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for stacked semiconductor devices
- Patent number 9,230,941
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having pads
- Patent number 9,209,145
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Chang Kun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having pads
- Patent number 9,190,372
- Issue date Nov 17, 2015
- SK Hynix Inc.
- Chang Kun Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404970
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS
- Publication number 20240332333
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE
- Publication number 20240030266
- Publication date Jan 25, 2024
- SK HYNIX INC.
- Pyong Su Kwag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230298959
- Publication date Sep 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Hiroyuki KANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS
- Publication number 20230260894
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Chu-Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230139657
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Hui Min YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230119348
- Publication date Apr 20, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE WITH BONDING ELECTRODES
- Publication number 20230083442
- Publication date Mar 16, 2023
- KIOXIA Corporation
- Hideaki MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220406746
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHODS FOR BONDING TESTED WAFERS AND T...
- Publication number 20220359456
- Publication date Nov 10, 2022
- AP MEMORY TECHNOLOGY CORPORATION
- WENLIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220189905
- Publication date Jun 16, 2022
- KIOXIA Corporation
- Genki SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20220173092
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR MODULE, AND POWER ELECTRO...
- Publication number 20220139797
- Publication date May 5, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Koji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220093548
- Publication date Mar 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY
- Publication number 20210104464
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200303347
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Kazutaka SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
- Publication number 20200126936
- Publication date Apr 23, 2020
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
- Publication number 20200006268
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20190371780
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20190096821
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
- Publication number 20180190621
- Publication date Jul 5, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas having different functions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor storage device with bonding electrodes

Chip package structure

Hybrid bonding with uniform pattern density

Semiconductor package and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor module, power semiconductor module, and power electro...

Semiconductor chip having chip pads of different surface areas, and...

Semiconductor package

Chip package structure

Alignment carrier for interconnect bridge assembly

Hybrid bonding with uniform pattern density

Semiconductor storage device and method of manufacturing the same

Manufacturing process for separating logic and memory array

Chip package structure and method for forming the same

Manufacturing process for separating logic and memory array

Semiconductor device including dual pad wire bond interconnection

Hybrid bonding with uniform pattern density

Manufacturing method of package structure having conductive shield

Optimized solder pads for microelectronic components

Stacked memory chip having reduced input-output load, memory module...

Semiconductor device

Integrated circuit package with probe pad structure

Semiconductor memory device having pads

Multi-layer pad ring for integrated circuit

Hybrid bonding with uniform pattern density

Methods of forming integrated circuit package

Bonding structure for stacked semiconductor devices

Semiconductor memory device having pads

Semiconductor memory device having pads

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

STACKED SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE

SEMICONDUCTOR DEVICE

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STORAGE DEVICE WITH BONDING ELECTRODES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHODS FOR BONDING TESTED WAFERS AND T...

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Hybrid Bonding with Uniform Pattern Density

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR MODULE, AND POWER ELECTRO...

SEMICONDUCTOR PACKAGE

ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY

MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY

Hybrid Bonding with Uniform Pattern Density

MANUFACTURING METHOD OF PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION