Bonding areas having different materials

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H01L2224/09505

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09505Bonding areas having different materials

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with conductive p...
- Patent number 11,955,446
- Issue date Apr 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive polymer liner and me...
- Patent number 11,569,189
- Issue date Jan 31, 2023
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with external electrode
- Patent number 11,037,865
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solders of different melting points and m...
- Patent number 10,622,285
- Issue date Apr 14, 2020
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses on bond wire arrangement
- Patent number 10,312,905
- Issue date Jun 4, 2019
- NXP USA, INC.
- Youri Volokhine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,163,773
- Issue date Dec 25, 2018
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 10,068,876
- Issue date Sep 4, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Kabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses of bond wire arrangement
- Patent number 9,979,388
- Issue date May 22, 2018
- NXP USA, INC.
- Youri Volokhine
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230230945
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE P...
- Publication number 20230078105
- Publication date Mar 16, 2023
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20220093546
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER AND ME...
- Publication number 20220068855
- Publication date Mar 3, 2022
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200203261
- Publication date Jun 25, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AN...
- Publication number 20190148279
- Publication date May 16, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT
- Publication number 20180269873
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Youri VOLOKHINE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT
- Publication number 20160269022
- Publication date Sep 15, 2016
- Youri VOLOKHINE
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas having different materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic assemblies with inductors in direct bonding regions

Method for forming semiconductor device structure with conductive p...

Semiconductor device structure with conductive polymer liner and me...

Semiconductor with external electrode

Semiconductor device with solders of different melting points and m...

Electronics package having a self-aligning interconnect assembly an...

Adjustable losses on bond wire arrangement

Electronics package having a self-aligning interconnect assembly an...

Semiconductor device and manufacturing method therefor

Adjustable losses of bond wire arrangement

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE P...

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER AND ME...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AN...

ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT

ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT