Bonding areas Manufacturing methods related thereto

Industry

CPC
H01L2224/02

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02Bonding areas Manufacturing methods related thereto

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 12,232,307
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-wafer RDLs in constructed wafers
- Patent number 12,230,513
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,224,257
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including a pluralit...
- Patent number 12,218,051
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,218,086
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,218,020
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of forming the same
- Patent number 12,218,009
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interposer structures
- Patent number 12,218,119
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
- Patent number 12,218,101
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,218,099
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
- Patent number 12,210,285
- Issue date Jan 28, 2025
- Toray Industries, Inc.
- Keika Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shared barrier layer in redistribution a...
- Patent number 12,211,823
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,205,937
- Issue date Jan 21, 2025
- LG Electronics Inc.
- Taehoon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 12,205,912
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure and method for manufac...
- Patent number 12,199,015
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20250062256
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062255
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP
- Publication number 20250062254
- Publication date Feb 20, 2025
- Shanghai Huali Integrated Circuit Corporation
- Tianquan SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
- Publication number 20250054886
- Publication date Feb 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054915
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SYSTEM
- Publication number 20250054857
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250046740
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jubin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR
- Publication number 20250038138
- Publication date Jan 30, 2025
- NXP B.V.
- Ting Hsun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029942
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Raeyoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package Having an Electronic Component an...
- Publication number 20250029884
- Publication date Jan 23, 2025
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20250029969
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Youngki JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMA...
- Publication number 20250022820
- Publication date Jan 16, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...
- Publication number 20250015022
- Publication date Jan 9, 2025
- SiPLP Microelectronics (Chongqing) Limited
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and forming method thereof
- Publication number 20250015023
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Chiu-Jung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20250015032
- Publication date Jan 9, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE-TO-WAFER HYBRID BONDING
- Publication number 20250015029
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIALS FOR DIRECT BONDING
- Publication number 20250006679
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH COVER LAYERS
- Publication number 20250006564
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250006676
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jinkyeong SEOL
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dummy metal bonding pads for underfill application in semiconductor...

Wafer level package with polymer layer delamination prevention desi...

Cross-wafer RDLs in constructed wafers

Semiconductor chip and semiconductor package including the same

Semiconductor structure and manufacturing method thereof

Semiconductor package and method of fabricating semiconductor package

Method of manufacturing a semiconductor device including a pluralit...

Semiconductor package and method of manufacturing same

Bonding to alignment marks with dummy alignment marks

Semiconductor packages

System, device and methods of manufacture

Semiconductor device with composite conductive features and method...

Semiconductor package and methods of forming the same

Stacked interposer structures

Three-dimensional stacking semiconductor assemblies and methods of...

Barrier structures between external electrical connectors

Interposer and semiconductor package including the same

Resin composition, resin sheet, cured film, method for producing cu...

Stiffener package and method of fabricating stiffener package

Semiconductor device with redistribution structure

Semiconductor package with shared barrier layer in redistribution a...

Semiconductor packages and methods of forming the same

Sensor packages

Semiconductor device, circuit board structure and manufacturing met...

Display device

Semiconductor package structure and method for preparing the same

Semiconductor device and a manufacturing method thereof

Semiconductor device including via structure and method for manufac...

Multi-die package structures including redistribution layers

Display substrate and preparation method thereof, and display appar...

Patents Applicationslast 30 patents

SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICE AND SYSTEM

SEMICONDUCTOR CHIP STRUCTURE

MICROELECTRONIC ASSEMBLIES

INTEGRATED CIRCUITS WITH CAPACITORS

Advanced Device Assembly Structures And Methods

Heterogeneous Fan-Out Structure and Method of Manufacture

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

SEMICONDUCTOR PACKAGE

Method of Manufacturing a Package Having an Electronic Component an...

LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMA...

FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...

Semiconductor structure and forming method thereof

3D-INTERCONNECT

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

MULTI-DIE-TO-WAFER HYBRID BONDING

CONDUCTIVE MATERIALS FOR DIRECT BONDING

SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...