Bonding areas on the body

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H01L2224/80125

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80125Bonding areas on the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 11,837,579
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding semiconductor devices
- Patent number 11,756,921
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,621,202
- Issue date Apr 4, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 10,998,293
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and interconnecting integrated circuit devices
- Patent number 10,170,450
- Issue date Jan 1, 2019
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...
- Publication number 20240387448
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Francisco MACHUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS
- Publication number 20240071989
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20230387071
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PLACING IN PACKAGING
- Publication number 20230137490
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20220302078
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
- Publication number 20220285233
- Publication date Sep 8, 2022
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210257340
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20200395339
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES
- Publication number 20180068984
- Publication date Mar 8, 2018
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas on the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure

System and method for bonding semiconductor devices

Electrical overlay measurement methods and structures for wafer-to-...

Method of fabricating semiconductor structure

Method for bonding and interconnecting integrated circuit devices

Patents Applicationslast 30 patents

System and Method for Bonding Semiconductor Devices

ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...

COMPENSATION METHOD FOR WAFER BONDING

SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS

System and Method for Bonding Semiconductor Devices

SEMICONDUCTOR PLACING IN PACKAGING

System and Method for Bonding Semiconductor Devices

ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...

SEMICONDUCTOR STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES