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H01L2224/83125

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83125Bonding areas on the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tiled light emitting diode display panel having different resistanc...
- Patent number 11,355,473
- Issue date Jun 7, 2022
- A.U. VISTA, INC.
- Fang-Chen Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of flip-chip assembly of two electronic components by UV ann...
- Patent number 9,613,924
- Issue date Apr 4, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve ultra-high chip-to-chip alignment accuracy for wa...
- Patent number 9,466,538
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Spyridon Skordas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,054,114
- Issue date Jun 9, 2015
- Xintec Inc.
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,779,558
- Issue date Jul 15, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,673,686
- Issue date Mar 18, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,409,925
- Issue date Apr 2, 2013
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Flip-Chip Assembly of Two Electronic Components by UV Ann...
- Publication number 20160372443
- Publication date Dec 22, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS...
- Publication number 20160225741
- Publication date Aug 4, 2016
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264771
- Publication date Sep 18, 2014
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130207240
- Publication date Aug 15, 2013
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313222
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313261
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110228506
- Publication date Sep 22, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222253
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110223695
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222252
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas on the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tiled light emitting diode display panel having different resistanc...

Conductive connecting member and manufacturing method of same

Method of flip-chip assembly of two electronic components by UV ann...

Method to achieve ultra-high chip-to-chip alignment accuracy for wa...

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Patents Applicationslast 30 patents

Method of Flip-Chip Assembly of Two Electronic Components by UV Ann...

METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components