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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
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Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
12,087,727
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of forming a joint assembly
Patent number
12,009,335
Issue date
Jun 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC chip package with dummy solder structure under corner, and relat...
Patent number
11,682,646
Issue date
Jun 20, 2023
MARVELL ASIA PTE. LTD.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing display device
Patent number
11,552,155
Issue date
Jan 10, 2023
Samsung Display Co., Ltd.
Chan-Jae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
11,502,056
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of forming a joint assembly
Patent number
11,355,468
Issue date
Jun 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC chip package with dummy solder structure under corner, and relat...
Patent number
11,171,104
Issue date
Nov 9, 2021
Marvell Asia Pte, Ltd.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
10,991,649
Issue date
Apr 27, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Tsung-Yuan Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package substrate
Patent number
10,770,387
Issue date
Sep 8, 2020
Intel Corporation
Qinglei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic circuit device and method for manufacturing electronic c...
Patent number
10,679,969
Issue date
Jun 9, 2020
Fujitsu Limited
Shoichi Miyahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of forming a joint assembly
Patent number
10,643,965
Issue date
May 5, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,510,652
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company Ltd.
Tsung-Yuan Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
Patent number
10,446,479
Issue date
Oct 15, 2019
STATS ChipPAC Pte. Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package substrate
Patent number
10,325,843
Issue date
Jun 18, 2019
Intel Corporation
Qinglei Zhang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Systems and processes for measuring thickness values of semiconduct...
Patent number
10,269,758
Issue date
Apr 23, 2019
Intel Corporation
Zhihua Zou
G01 - MEASURING TESTING
Information
Patent Grant
Display device having the bumps in the middle zone parallel to the...
Patent number
10,242,605
Issue date
Mar 26, 2019
BOE Technology Group Co., Ltd.
Liqiang Chen
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Conductive connecting member and manufacturing method of same
Patent number
10,177,079
Issue date
Jan 8, 2019
Furukawa Electric Co., Ltd.
Hideo Nishikubo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
Patent number
9,842,798
Issue date
Dec 12, 2017
STATS ChipPAC Pte. Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package substrate
Patent number
9,831,169
Issue date
Nov 28, 2017
Intel Corporation
Qinglei Zhang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Tin-indium based low temperature solder alloy
Patent number
9,741,676
Issue date
Aug 22, 2017
Indium Corporation
Jianguo Luo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Alignment of three dimensional integrated circuit components
Patent number
9,721,855
Issue date
Aug 1, 2017
International Business Machines Corporation
Joseph Kuczynski
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of flip-chip assembly of two electronic components by UV ann...
Patent number
9,613,924
Issue date
Apr 4, 2017
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Abdelkader Aliane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including asymmetric electrode arrangement
Patent number
9,585,197
Issue date
Feb 28, 2017
Samsung Electronics Co., Ltd.
Chin-sung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment of three dimensional integrated circuit components
Patent number
9,508,614
Issue date
Nov 29, 2016
International Business Machines Corporation
Joseph Kuczynski
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip structure and chip package structure
Patent number
8,618,678
Issue date
Dec 31, 2013
Himax Technologies Limited
Chiu-Shun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High speed method of aligning components having a plurality of non-...
Patent number
8,611,636
Issue date
Dec 17, 2013
Cognex Corporation
Nathaniel Bogan
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
Publication number
20240339432
Publication date
Oct 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20240282743
Publication date
Aug 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
Publication number
20220359458
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20220302069
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
Publication number
20220013492
Publication date
Jan 13, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE
Publication number
20210151543
Publication date
May 20, 2021
SAMSUNG DISPLAY CO., LTD.
Chan-Jae PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
Publication number
20210125952
Publication date
Apr 29, 2021
Marvell International Ltd.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20200118916
Publication date
Apr 16, 2020
Taiwan Semiconductor Manufacturing company Ltd.
TSUNG-YUAN YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20200006276
Publication date
Jan 2, 2020
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
Publication number
20190304892
Publication date
Oct 3, 2019
Intel Corporation
Qinglei ZHANG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC C...
Publication number
20180247917
Publication date
Aug 30, 2018
Fujitsu Limited
Shoichi MIYAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
Publication number
20180138118
Publication date
May 17, 2018
Intel Corporation
Qinglei ZHANG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
Publication number
20180068937
Publication date
Mar 8, 2018
STATS ChipPAC Pte Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180047664
Publication date
Feb 15, 2018
TSUNG-YUAN YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY
Publication number
20170373034
Publication date
Dec 28, 2017
Indium Corporation
Jianguo Luo
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20170345786
Publication date
Nov 30, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND PROCESSES FOR MEASURING THICKNESS VALUES OF SEMICONDUCT...
Publication number
20170186722
Publication date
Jun 29, 2017
Intel Corporation
Zhihua Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
Publication number
20160379923
Publication date
Dec 29, 2016
Intel Corporation
Qinglei ZHANG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of Flip-Chip Assembly of Two Electronic Components by UV Ann...
Publication number
20160372443
Publication date
Dec 22, 2016
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Abdelkader ALIANE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
Publication number
20160351530
Publication date
Dec 1, 2016
Micron Technology, Inc.
Jaspreet S. Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNMENT OF THREE DIMENSIONAL INTEGRATED CIRCUIT COMPONENTS
Publication number
20160172252
Publication date
Jun 16, 2016
International Business Machines Corporation
Joseph Kuczynski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
Publication number
20140103527
Publication date
Apr 17, 2014
STATS ChipPAC, Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
Publication number
20130001775
Publication date
Jan 3, 2013
Hideo Nishikubo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE AND CHIP PACKAGE STRUCTURE
Publication number
20100109157
Publication date
May 6, 2010
HIMAX TECHNOLOGIES LIMITED
Chiu-Shun Lin
H01 - BASIC ELECTRIC ELEMENTS