Bonding areas outside the body

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CPC
H01L2224/80127

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80127Bonding areas outside the body

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Patents Grantslast 30 patents

Information Patent Grant
Flexible display panel, display device nd bonding method thereof
- Patent number 10,451,932
- Issue date Oct 22, 2019
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mounting components in semiconductor fabricat...
- Patent number 10,438,922
- Issue date Oct 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR MOUNTING COMPONENTS IN SEMICONDUCTOR FABRICAT...
- Publication number 20170352641
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS