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H01L2224/81127

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Electronic circuit device and method for manufacturing electronic c...
- Patent number 10,679,969
- Issue date Jun 9, 2020
- Fujitsu Limited
- Shoichi Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having the bumps in the middle zone parallel to the...
- Patent number 10,242,605
- Issue date Mar 26, 2019
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 9,842,798
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Semiconductor manufacturing apparatuses comprising bonding heads
- Patent number 9,508,577
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Byung Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC C...
- Publication number 20180247917
- Publication date Aug 30, 2018
- Fujitsu Limited
- Shoichi MIYAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20140103527
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic circuit device and method for manufacturing electronic c...

Semiconductor device and method of forming a PoP device with embedd...

Display device having the bumps in the middle zone parallel to the...

Conductive connecting member and manufacturing method of same

Underfill material, laminated sheet and method for producing semico...

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device including asymmetric electrode arrangement

Electronic component-mounted structure, IC card and COF package

Semiconductor manufacturing apparatuses comprising bonding heads

Patents Applicationslast 30 patents

ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC C...

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming a POP Device with Embedd...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME