Bonding areas outside the body

Industry

CPC
H01L2224/83127

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83127Bonding areas outside the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packages with pre-defined via patterns and methods of ma...
- Patent number 10,141,251
- Issue date Nov 27, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatuses comprising bonding heads
- Patent number 9,508,577
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Byung Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,287,188
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for contacting a chip
- Patent number 9,224,086
- Issue date Dec 29, 2015
- Smartrac IP B.V.
- Manfred Rietzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,054,114
- Issue date Jun 9, 2015
- Xintec Inc.
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,779,558
- Issue date Jul 15, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,673,686
- Issue date Mar 18, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,409,925
- Issue date Apr 2, 2013
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264771
- Publication date Sep 18, 2014
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for a Seal Ring Structure
- Publication number 20140217557
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130207240
- Publication date Aug 15, 2013
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313222
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313261
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING A CHIP
- Publication number 20120234579
- Publication date Sep 20, 2012
- Manfred Rietzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110228506
- Publication date Sep 22, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222253
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110223695
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222252
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip assembly

Chip assembly

Conductive connecting member and manufacturing method of same

Electronic packages with pre-defined via patterns and methods of ma...

Underfill material, laminated sheet and method for producing semico...

Method of forming a chip assembly with a die attach liquid

Method and apparatus for a seal ring structure

Mounting method

Semiconductor manufacturing apparatuses comprising bonding heads

Method and apparatus for a seal ring structure

Method for contacting a chip

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Method and Apparatus for a Seal Ring Structure

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR CONTACTING A CHIP

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components