Bonding areas specifically adapted for connectors of different types

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H01L2224/04073

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/04073Bonding areas specifically adapted for connectors of different types

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,074,193
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,749,711
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna substrate and manufacturing...
- Patent number 11,664,580
- Issue date May 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element covered by pol...
- Patent number 11,621,317
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,233,116
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with magneti...
- Patent number 11,094,776
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 10,784,216
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Won-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with magneti...
- Patent number 10,756,162
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 10,297,559
- Issue date May 21, 2019
- Samsung Electronics Co., Ltd.
- Won-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,157,875
- Issue date Dec 18, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnection structure with confinement layer
- Patent number 10,032,698
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,780,049
- Issue date Oct 3, 2017
- Samsung Electronics Co., Ltd.
- Jin-chan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with confinement layer
- Patent number 9,673,132
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacting Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, semiconductor package and method of manufacturin...
- Patent number 9,640,503
- Issue date May 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup element and solid-state image pickup eleme...
- Patent number 9,583,526
- Issue date Feb 28, 2017
- Hamamatsu Photonics K.K.
- Tomohiro Ikeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 9,570,410
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a lead, package-on-package device includ...
- Patent number 9,543,275
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Yun-rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,515,006
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,508,702
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solderable and bondable electrical cont...
- Patent number 9,496,237
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad structure to reduce bond pad corrosion
- Patent number 8,994,181
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via with embedded barrier pad
- Patent number 8,980,741
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pads of enhanced moisture blocking ability
- Patent number 8,906,705
- Issue date Dec 9, 2014
- Fujitsu Semiconductor Limited
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry component and method for forming the same
- Patent number 8,884,433
- Issue date Nov 11, 2014
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures and electronic devices including hy...
- Patent number 8,872,310
- Issue date Oct 28, 2014
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20240363676
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230361156
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230238422
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20220140065
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20210376054
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20200350395
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH MAGNETI...
- Publication number 20200075448
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20190252332
- Publication date Aug 15, 2019
- Samsung Electronics Co., Ltd.
- Won-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure with Confinement Layer
- Publication number 20170271242
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20170033065
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WIRE BONDING AND METHOD
- Publication number 20160379953
- Publication date Dec 29, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...
- Publication number 20160155716
- Publication date Jun 2, 2016
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION AND ELECTRICAL CONNECTION
- Publication number 20150097300
- Publication date Apr 9, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150084170
- Publication date Mar 26, 2015
- Hohyeuk IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
- Publication number 20150035171
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING SOLDER BALLS FROM CHIP
- Publication number 20140373869
- Publication date Dec 25, 2014
- Jincheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140339704
- Publication date Nov 20, 2014
- Jin-chan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via with Embedded Barrier Pad
- Publication number 20140287581
- Publication date Sep 25, 2014
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140225276
- Publication date Aug 14, 2014
- Xintec Inc.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP ELEME...
- Publication number 20140091421
- Publication date Apr 3, 2014
- Hamamatsu Photonics K.K.
- Tomohiro Ikeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via with Embedded Barrier Pad
- Publication number 20130285244
- Publication date Oct 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SA...
- Publication number 20130187289
- Publication date Jul 25, 2013
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20130093104
- Publication date Apr 18, 2013
- UNITED MICROELECTRONICS CORPORATION
- Hui-Min WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130075727
- Publication date Mar 28, 2013
- PANASONIC CORPORATION
- Masao TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION
- Publication number 20130043598
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKABLE DEVICES AND A METH...
- Publication number 20120228767
- Publication date Sep 13, 2012
- Sang-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD
- Publication number 20120178189
- Publication date Jul 12, 2012
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
- Publication number 20120122311
- Publication date May 17, 2012
- Chun-Pin CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Bonding areas specifically adapted for connectors of different types

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structure with magnetic element

Semiconductor structure having polygonal bonding pad

Semiconductor device structure with magnetic element

Semiconductor package including antenna substrate and manufacturing...

Semiconductor device structure with magnetic element covered by pol...

Semiconductor device structure with magnetic element

Structure and formation method of semiconductor device with magneti...

Semiconductor device and semiconductor package including the same

Structure and formation method of semiconductor device with magneti...

Semiconductor device and semiconductor package including the same

Chip package and method for forming the same

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Interconnection structure with confinement layer

Semiconductor package

Interconnection structure with confinement layer

Package substrate, semiconductor package and method of manufacturin...

Solid-state image pickup element and solid-state image pickup eleme...

Methods of forming connector pad structures, interconnect structure...

Segmented bond pads and methods of fabrication thereof

Semiconductor package with a lead, package-on-package device includ...

3D device packaging using through-substrate posts

3D device packaging using through-substrate posts

Semiconductor device having solderable and bondable electrical cont...

Semiconductor structure with low-melting-temperature conductive reg...

Junction and electrical connection

Bond pad structure to reduce bond pad corrosion

Through silicon via with embedded barrier pad

Semiconductor device with pads of enhanced moisture blocking ability

Circuitry component and method for forming the same

Semiconductor device structures and electronic devices including hy...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH MAGNETI...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Interconnection Structure with Confinement Layer

Methods of Forming Connector Pad Structures, Interconnect Structure...

SEMICONDUCTOR WIRE BONDING AND METHOD

PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...

JUNCTION AND ELECTRICAL CONNECTION

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Segmented Bond Pads and Methods of Fabrication Thereof

METHOD FOR REMOVING SOLDER BALLS FROM CHIP

SEMICONDUCTOR PACKAGE

Through Silicon Via with Embedded Barrier Pad

CHIP PACKAGE

SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP ELEME...

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

Through Silicon Via with Embedded Barrier Pad

SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SA...

BOND PAD STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKABLE DEVICES AND A METH...

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS