Bonding areas specifically adapted for tape automated bonding [TAB] connectors

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CPC
H01L2224/0405

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0405Bonding areas specifically adapted for tape automated bonding [TAB] connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with surface electrodes
- Patent number 8,963,315
- Issue date Feb 24, 2015
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and film and tab package comprising the chip and...
- Patent number 8,952,510
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and film and TAB package comprising the chip and...
- Patent number 8,575,735
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer via and method of making same
- Patent number 8,035,198
- Issue date Oct 11, 2011
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having polyimide/metal passivation layer and met...
- Patent number 4,827,326
- Issue date May 2, 1989
- Motorola, Inc.
- Leonard F. Altman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20140084430
- Publication date Mar 27, 2014
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20110210433
- Publication date Sep 1, 2011
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110186981
- Publication date Aug 4, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electrical and mechanical connection and an...
- Publication number 20100193234
- Publication date Aug 5, 2010
- Albert-Ludwigs-Universitat Freiburg
- Sebastian Kisban
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THROUGH WAFER VIA AND METHOD OF MAKING SAME
- Publication number 20100032808
- Publication date Feb 11, 2010
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas specifically adapted for tape automated bonding [TAB] connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnection of microelectronic devices

High density interconnection of microelectronic devices

Semiconductor device with surface electrodes

Semiconductor chip and film and tab package comprising the chip and...

Semiconductor chip and film and TAB package comprising the chip and...

Through wafer via and method of making same

Integrated circuit having polyimide/metal passivation layer and met...

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for producing an electrical and mechanical connection and an...

THROUGH WAFER VIA AND METHOD OF MAKING SAME