Bonding environment

Industry

CPC
H01L2224/83053

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83053Bonding environment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method
- Patent number 11,631,586
- Issue date Apr 18, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous device
- Patent number 10,777,533
- Issue date Sep 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 9,698,126
- Issue date Jul 4, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 8,735,219
- Issue date May 27, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20230207322
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20200328193
- Publication date Oct 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement and Method for Joining at Least Two Joining Partners
- Publication number 20200294956
- Publication date Sep 17, 2020
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20170301656
- Publication date Oct 19, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20160099233
- Publication date Apr 7, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out WLP With Package
- Publication number 20150044824
- Publication date Feb 12, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20140061942
- Publication date Mar 6, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20140061949
- Publication date Mar 6, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS

Bonding environment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Arrangement and method for joining at least two joining partners

Heterogeneous annealing method

Heterogeneous device

Heterogeneous annealing method and device

Method for manufacturing a fan-out WLP with package

Heterogeneous annealing method and device

Patents Applicationslast 30 patents

HETEROGENEOUS ANNEALING METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

Arrangement and Method for Joining at Least Two Joining Partners

HETEROGENEOUS ANNEALING METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

Fan-Out WLP With Package

HETEROGENEOUS ANNEALING METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

FAN-OUT WLP WITH PACKAGE