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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/75301
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Patents Grants
last 30 patents
Information
Patent Grant
Laser bonding system and laser bonding apparatus
Patent number
11,973,053
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Geun Woo Kim
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Radiative heat collective bonder and gangbonder
Patent number
11,804,467
Issue date
Oct 31, 2023
Micron Technology, Inc.
Chao Wen Wang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
11,778,842
Issue date
Oct 3, 2023
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Arrangement and method for joining at least two joining partners
Patent number
11,676,933
Issue date
Jun 13, 2023
Infineon Technologies AG
Steffen Hartmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
Patent number
11,651,983
Issue date
May 16, 2023
Suss MicroTec Lithography GmbH
Hale Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reflow method and system
Patent number
11,610,859
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Shiuan Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Adhesive for semiconductor device, and high productivity method for...
Patent number
11,608,455
Issue date
Mar 21, 2023
SHOWA DENKO MATERIALS CO., LTD.
Kazutaka Honda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Mounting apparatus and mounting system
Patent number
11,545,462
Issue date
Jan 3, 2023
Shinkawa Ltd.
Tomonori Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for embedding semiconductor devices
Patent number
11,538,699
Issue date
Dec 27, 2022
Rohinni, LLC
Cody Peterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
PTFE sheet and method for mounting die
Patent number
11,512,411
Issue date
Nov 29, 2022
Shinkawa Ltd.
Osamu Watanabe
D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information
Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
Patent number
11,515,286
Issue date
Nov 29, 2022
Kulicke and Soffa Industries, Inc.
Adeel Ahmad Bajwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible circuit film bonding apparatus and method of bonding flexi...
Patent number
11,515,283
Issue date
Nov 29, 2022
Samsung Display Co., Ltd.
Chung-Seok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting apparatus and mounting system
Patent number
11,508,689
Issue date
Nov 22, 2022
Shinkawa Ltd.
Tomonori Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soldering device and a method for producing a solder connection of...
Patent number
11,491,567
Issue date
Nov 8, 2022
Pink GmbH Thermosysteme
Aaron Hutzler
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
11,387,211
Issue date
Jul 12, 2022
Shinkawa Ltd.
Tetsuya Otani
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
11,380,862
Issue date
Jul 5, 2022
Apple Inc.
Andreas Bibi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Bonder
Patent number
11,367,702
Issue date
Jun 21, 2022
Tazmo Co., Ltd.
Masaaki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding and indexing apparatus
Patent number
11,362,058
Issue date
Jun 14, 2022
Nexperia B.V.
Ralph Huybers
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for processing a semiconductor device
Patent number
11,227,779
Issue date
Jan 18, 2022
ASM Technology Singapore Pte. Ltd.
Jiapei Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for setting conditions for heating semiconductor chip during...
Patent number
11,201,132
Issue date
Dec 14, 2021
Shinkawa Ltd.
Tomonori Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and related techniques for handling aligned substrate pairs
Patent number
11,183,401
Issue date
Nov 23, 2021
Suss MicroTec Lithography GmbH
Hale Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
10,971,471
Issue date
Apr 6, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
10,964,900
Issue date
Mar 30, 2021
Apple Inc.
Andreas Bibl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding wafers and bonding tool
Patent number
10,872,873
Issue date
Dec 22, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chien-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
Patent number
10,825,705
Issue date
Nov 3, 2020
Suss MicroTec Lithography GmbH
Hale Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device including heating and...
Patent number
10,669,454
Issue date
Jun 2, 2020
Hitachi Chemical Company, Ltd.
Kazutaka Honda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Imaging system and manufacturing apparatus
Patent number
10,573,621
Issue date
Feb 25, 2020
Semiconductor Energy Laboratory Co., Ltd.
Akio Endo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component handling unit
Patent number
10,497,590
Issue date
Dec 3, 2019
Shinkawa Ltd.
Kohei Seyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component bonding device and electronic component mounter
Patent number
10,462,950
Issue date
Oct 29, 2019
FUJI CORPORATION
Masaki Murai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
10,411,210
Issue date
Sep 10, 2019
Apple Inc.
Andreas Bibl
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
Publication number
20240332245
Publication date
Oct 3, 2024
Samsung Electronics Co., Ltd.
Dae Seo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
COMPRESSION TYPE LASER REFLOW APPARATUS WITH VACUUM CHAMBER
Publication number
20230387069
Publication date
Nov 30, 2023
LASERSSEL CO., LTD.
Jae Joon CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
Publication number
20230268313
Publication date
Aug 24, 2023
SHINKAWA LTD.
Kohei SEYAMA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
Publication number
20230230853
Publication date
Jul 20, 2023
SHINKAWA LTD.
Daisuke TANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING APPARATUS
Publication number
20220415845
Publication date
Dec 29, 2022
SHINKAWA LTD.
Alexander DZHANGIROV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING AND INDEXING METHOD
Publication number
20220310553
Publication date
Sep 29, 2022
NEXPERIA B.V.
Ralph HUYBERS
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20220293876
Publication date
Sep 15, 2022
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
REFLOW METHOD AND SYSTEM
Publication number
20220130795
Publication date
Apr 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER BONDING SYSTEM AND LASER BONDING APPARATUS
Publication number
20220068871
Publication date
Mar 3, 2022
Samsung Electronics Co., Ltd.
Geun Woo KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RADIATIVE HEAT COLLECTIVE BONDER AND GANGBONDER
Publication number
20210407958
Publication date
Dec 30, 2021
Micron Technology, Inc.
Chao Wen Wang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
Publication number
20210265303
Publication date
Aug 26, 2021
KULICKE AND SOFFA INDUSTRIES, INC.
Adeel Ahmad Bajwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20210257572
Publication date
Aug 19, 2021
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
Publication number
20210121962
Publication date
Apr 29, 2021
SEMIKRON ELEKTRONIK GMBH & CO. KG
DOMINIC BIRKICHT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
Publication number
20210013079
Publication date
Jan 14, 2021
SUSS MICROTEC LITHOGRAPHY GMBH
Hale Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...
Publication number
20200373276
Publication date
Nov 26, 2020
SAMSUNG DISPLAY CO., LTD.
Chung-Seok LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Arrangement and Method for Joining at Least Two Joining Partners
Publication number
20200294956
Publication date
Sep 17, 2020
Steffen Hartmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PTFE SHEET AND METHOD FOR MOUNTING DIE
Publication number
20200291548
Publication date
Sep 17, 2020
SHINKAWA LTD.
Osamu WATANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
Publication number
20200286854
Publication date
Sep 10, 2020
SHINKAWA LTD.
Tomonori NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20200243476
Publication date
Jul 30, 2020
SHINKAWA LTD.
Tetsuya OTANI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MOUNTING APPARATUS AND MOUNTING SYSTEM
Publication number
20200235070
Publication date
Jul 23, 2020
SHINKAWA LTD.
Tomonori NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20200212001
Publication date
Jul 2, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
Publication number
20200095481
Publication date
Mar 26, 2020
Hitachi Chemical Company, Ltd.
Kazutaka HONDA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
BONDER
Publication number
20190393185
Publication date
Dec 26, 2019
TAZMO CO., LTD.
Masaaki TANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
Publication number
20190148333
Publication date
May 16, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
Publication number
20190080939
Publication date
Mar 14, 2019
ASM Technology Singapore Pte Ltd
Jiapei DING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT HANDLING UNIT
Publication number
20190006211
Publication date
Jan 3, 2019
SHINKAWA LTD.
Kohei SEYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
Publication number
20180218994
Publication date
Aug 2, 2018
DEXERIALS CORPORATION
Kouichi SATO
B32 - LAYERED PRODUCTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20180102492
Publication date
Apr 12, 2018
Apple Inc.
Andreas Bibl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20180026006
Publication date
Jan 25, 2018
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS