Bonding interface between the connecting portion and the bonding area

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H01L2224/4852

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4852Bonding interface between the connecting portion and the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,854,810
- Issue date Dec 26, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,631,587
- Issue date Apr 18, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-bonded and run-out compensated light emitting diodes
- Patent number 11,569,091
- Issue date Jan 31, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,430,658
- Issue date Aug 30, 2022
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that includes a molecular bonding layer for bo...
- Patent number 10,163,765
- Issue date Dec 25, 2018
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING BASED MANUFACTURE OF LIGHT EMITTING DIODES
- Publication number 20220399203
- Publication date Dec 15, 2022
- Meta Platforms Technologies, LLC
- Stephan LUTGEN
- G02 - OPTICS
Information Patent Application
BONDING METHODS FOR LIGHT EMITTING DIODES
- Publication number 20220262637
- Publication date Aug 18, 2022
- Facebook Technologies, LLC
- Stephan LUTGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...
- Publication number 20170301615
- Publication date Oct 19, 2017
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE
- Publication number 20170012018
- Publication date Jan 12, 2017
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interface between the connecting portion and the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Palladium-coated copper bonding wire, wire bonding structure, semic...

Bonding methods for light emitting diodes

Bonding methods for light emitting diodes

Hybrid-bonded and run-out compensated light emitting diodes

Bonding methods for light emitting diodes

Semiconductor device and method of manufacturing the same

Semiconductor device that includes a molecular bonding layer for bo...

Lead-free soldering method and soldered article

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

HYBRID BONDING BASED MANUFACTURE OF LIGHT EMITTING DIODES

BONDING METHODS FOR LIGHT EMITTING DIODES

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF