Bonding interfaces of the layer connector

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CPC
H01L2224/8334

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8334Bonding interfaces of the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical connecting structure having nano-twins copper
- Patent number 11,715,721
- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
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- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
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Semiconductor device, fabrication method for a semiconductor device...
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- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
- Patent number 11,145,619
- Issue date Oct 12, 2021
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
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Metallic interconnect, a method of manufacturing a metallic interco...
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- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
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Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
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Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,431,621
- Issue date Oct 1, 2019
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- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,038,024
- Issue date Jul 31, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for bonding a hermetic module to an electrode array
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- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,911,778
- Issue date Mar 6, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat dissipation structure, fabricating method, and electronic appa...
- Patent number 9,659,836
- Issue date May 23, 2017
- Fujitsu Limited
- Yukie Sakita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,443,802
- Issue date Sep 13, 2016
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for height registration during chip bonding
- Patent number 9,324,682
- Issue date Apr 26, 2016
- Skorpios Technologies, Inc.
- Elton Marchena
- G02 - OPTICS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,111,763
- Issue date Aug 18, 2015
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 9,034,751
- Issue date May 19, 2015
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 8,802,553
- Issue date Aug 12, 2014
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free wafer bonding using channels
- Patent number 8,652,935
- Issue date Feb 18, 2014
- Tessera, Inc.
- Ilyas Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,524,533
- Issue date Sep 3, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying solder to semiconductor chips using decals w...
- Patent number 8,272,120
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Peter A. Gruber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level integrated interconnect decal and manufacturing method...
- Patent number 8,138,020
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die level integrated interconnect decal manufacturing method and ap...
- Patent number 8,053,283
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Peter A. Gruber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,842,540
- Issue date Nov 30, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,602,070
- Issue date Oct 13, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for room temperature metal direct bonding
- Patent number 6,962,835
- Issue date Nov 8, 2005
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
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- Semiconductor Components Industries, LLC
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230245969
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Masaya IMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnection between an Electric Component...
- Publication number 20210118842
- Publication date Apr 22, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...
- Publication number 20210020599
- Publication date Jan 21, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...
- Publication number 20190043820
- Publication date Feb 7, 2019
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20180277585
- Publication date Sep 27, 2018
- SONY CORPORATION
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20170170132
- Publication date Jun 15, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
- Publication number 20160343684
- Publication date Nov 24, 2016
- Innovative Micro Technology
- Christopher S. GUDEMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20140362267
- Publication date Dec 11, 2014
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20140329361
- Publication date Nov 6, 2014
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING
- Publication number 20140319656
- Publication date Oct 30, 2014
- Skorpios Technologies, Inc.
- Elton Marchena
- G02 - OPTICS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MAKING CONDUCTIVE CONNECTION
- Publication number 20140290059
- Publication date Oct 2, 2014
- FUJIFILM CORPORATION
- Takeaki KAWASHIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20130009321
- Publication date Jan 10, 2013
- SONY CORPORATION
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20120208323
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE WAFER BONDING USING CHANNELS
- Publication number 20120153426
- Publication date Jun 21, 2012
- Tessera Research LLC
- Vage Oganesian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110272450
- Publication date Nov 10, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110237030
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD...
- Publication number 20110233762
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20110041329
- Publication date Feb 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20070232023
- Publication date Oct 4, 2007
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Room temperature metal direct bonding
- Publication number 20050161795
- Publication date Jul 28, 2005
- Ziptronix
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bonding interfaces of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical connecting structure having nano-twins copper

Anisotropic conductive film and display device using the same

Semiconductor device, fabrication method for a semiconductor device...

Electrical connecting structure having nano-twins copper and method...

Semiconductor device, fabrication method for a semiconductor device...

Metallic interconnect, a method of manufacturing a metallic interco...

Power electronics assembly having an adhesion layer, and method for...

Semiconductor device, fabrication method for a semiconductor device...

Three dimensional device integration method and integrated device

Anisotropic conductive film and display device using the same

Method for permanently bonding wafers by a connecting layer by mean...

Room temperature metal direct bonding

Semiconductor device, fabrication method for a semiconductor device...

Method for bonding a hermetic module to an electrode array

Semiconductor device, fabrication method for a semiconductor device...

Heat dissipation structure, fabricating method, and electronic appa...

Semiconductor device, fabrication method for a semiconductor device...

Room temperature metal direct bonding

Method and system for height registration during chip bonding

Semiconductor device, fabrication method for a semiconductor device...

Method for mounting a semiconductor chip on a carrier

Method for mounting a semiconductor chip on a carrier

Void-free wafer bonding using channels

Room temperature metal direct bonding

Apparatus for applying solder to semiconductor chips using decals w...

Wafer level integrated interconnect decal and manufacturing method...

Die level integrated interconnect decal manufacturing method and ap...

Room temperature metal direct bonding

Room temperature metal direct bonding

Method for room temperature metal direct bonding

Patents Applicationslast 30 patents

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR APPARATUS

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

Method of Forming an Interconnection between an Electric Component...

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

ROOM TEMPERATURE METAL DIRECT BONDING

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

Massively parallel transfer of microLED devices

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

THERMOCOMPRESSION BONDING WITH RAISED FEATURE

ROOM TEMPERATURE METAL DIRECT BONDING

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

Method for Mounting a Semiconductor Chip on a Carrier

METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MAKING CONDUCTIVE CONNECTION

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

ROOM TEMPERATURE METAL DIRECT BONDING

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

Method for Mounting a Semiconductor Chip on a Carrier

VOID-FREE WAFER BONDING USING CHANNELS

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...

WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD...

ROOM TEMPERATURE METAL DIRECT BONDING

ROOM TEMPERATURE METAL DIRECT BONDING

Room temperature metal direct bonding