Bonding interfaces of the semiconductor or solid state body

Industry

CPC
H01L2224/8536

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8536Bonding interfaces of the semiconductor or solid state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,867,893
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit arrangement and method of manufacturing the same
- Patent number 10,327,333
- Issue date Jun 18, 2019
- Koninklijke Philips N.V.
- Ronald Dekker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 10,153,247
- Issue date Dec 11, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,865,560
- Issue date Jan 9, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including applying u...
- Patent number 9,508,678
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,502,371
- Issue date Nov 22, 2016
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming articles including metal structures having maxim...
- Patent number 9,468,986
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES, INC.
- Ernesto Gene de la Garza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,406,590
- Issue date Aug 2, 2016
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 9,171,821
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short tail recovery techniques in wire bonding operations
- Patent number 9,165,842
- Issue date Oct 20, 2015
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 8,952,549
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of a wire element with a microelectronic chip with a groov...
- Patent number 8,723,312
- Issue date May 13, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,319,353
- Issue date Nov 27, 2012
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection by fitting together two soldered inserts
- Patent number 8,093,728
- Issue date Jan 10, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,030,098
- Issue date Oct 4, 2011
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for fabricating an assembly of at least two micro...
- Patent number 8,012,795
- Issue date Sep 6, 2011
- Commissariat a l'Energie Atomique
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor chip assembly with welded metal pillar and enlarged p...
- Patent number 7,750,483
- Issue date Jul 6, 2010
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package on package having plug-socket type wire conne...
- Patent number 7,652,367
- Issue date Jan 26, 2010
- Samsung Electronics Co., Ltd.
- Kyung-Lae Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for increasing the strength of a bond made by a s...
- Patent number 7,482,260
- Issue date Jan 27, 2009
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ball and via package and formation process
- Patent number 7,442,641
- Issue date Oct 28, 2008
- Kulicke and Soffa Industries, Inc.
- David T. Beatson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for increasing the strength of a bond made by a s...
- Patent number 7,265,452
- Issue date Sep 4, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-locking wire bond structure and method of making the same
- Patent number 7,073,702
- Issue date Jul 11, 2006
- International Business Machines Corporation
- John A Fitzsimmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roughened bonding pad and bonding wire surfaces for low pressure wi...
- Patent number 7,015,580
- Issue date Mar 21, 2006
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for increasing the strength of a bond made by a s...
- Patent number 6,908,787
- Issue date Jun 21, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device
- Patent number 6,815,260
- Issue date Nov 9, 2004
- Oki Electric Industry Co., Ltd.
- Yoshihiko Ino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,573,121
- Issue date Jun 3, 2003
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad structure and method for reduced downward force wirebonding
- Patent number 6,478,212
- Issue date Nov 12, 2002
- International Business Machines Corporation
- Brett H. Engel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of making same
- Patent number 6,414,380
- Issue date Jul 2, 2002
- Oki Electric Industry Co., Ltd.
- Yoshihiko Ino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170345787
- Publication date Nov 30, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170040280
- Publication date Feb 9, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20150228618
- Publication date Aug 13, 2015
- RENESAS ELECTRONICS CORPORATION
- Naoki KAWANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT TAIL RECOVERY TECHNIQUES IN WIRE BONDING OPERATIONS
- Publication number 20150200143
- Publication date Jul 16, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20150132888
- Publication date May 14, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150125996
- Publication date May 7, 2015
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140371744
- Publication date Dec 18, 2014
- Koninklijke Philips N.V.
- Ronald Dekker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140312478
- Publication date Oct 23, 2014
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130200514
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...
- Publication number 20120205812
- Publication date Aug 16, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBONDING PROCESS
- Publication number 20110192885
- Publication date Aug 11, 2011
- NXP B.V.
- Hendrik Pieter HOCHSTENBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOV...
- Publication number 20110001237
- Publication date Jan 6, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BY FITTING TOGETHER TWO SOLDERED INSERTS
- Publication number 20100072631
- Publication date Mar 25, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE
- Publication number 20100007009
- Publication date Jan 14, 2010
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for fabricating an assembly of at least two micro...
- Publication number 20090227069
- Publication date Sep 10, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ON PACKAGE HAVING PLUG-SOCKET TYPE WIRE CONNE...
- Publication number 20080150116
- Publication date Jun 26, 2008
- Kyung-Lae JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for increasing the strength of a bond made by a s...
- Publication number 20080064208
- Publication date Mar 13, 2008
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire positioning and mechanical attachment for a radio-frequency in...
- Publication number 20060097911
- Publication date May 11, 2006
- Quelis ID Systems Inc.
- Christian Bussiere
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated ball and via package and formation process
- Publication number 20050260791
- Publication date Nov 24, 2005
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for increasing the strength of a bond made by a s...
- Publication number 20050150933
- Publication date Jul 14, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Roughened bonding pad and bonding wire surfaces for low pressure wi...
- Publication number 20050112861
- Publication date May 26, 2005
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-locking wire bond structure and method of making the same
- Publication number 20050082347
- Publication date Apr 21, 2005
- International Business Machines Corporation
- John A Fitzsimmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for increasing the strength of a bond made by a s...
- Publication number 20050003584
- Publication date Jan 6, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making semiconductor device
- Publication number 20020142520
- Publication date Oct 3, 2002
- Yoshihiko Ino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of making same
- Publication number 20020056895
- Publication date May 16, 2002
- Yoshihiko Ino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for fabricating the semiconductor devi...
- Publication number 20020027265
- Publication date Mar 7, 2002
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces of the semiconductor or solid state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods for forming a semiconductor device

Electronic circuit arrangement and method of manufacturing the same

Methods of forming wire interconnect structures

Methods of forming wire interconnect structures

Methods for forming semiconductor devices with stepped bond pads

Method of manufacturing a semiconductor device including applying u...

Methods of forming wire interconnect structures

Methods of forming articles including metal structures having maxim...

Chip package and manufacturing method thereof

Semiconductor packages and methods of manufacturing the same

Short tail recovery techniques in wire bonding operations

Semiconductor packages and methods of manufacturing the same

Assembly of a wire element with a microelectronic chip with a groov...

Pre-formed conductive bumps on bonding pads

Connection by fitting together two soldered inserts

Semiconductor package and method for processing and bonding a wire

Pre-formed conductive bumps on bonding pads

Method and device for fabricating an assembly of at least two micro...

Semiconductor chip assembly with welded metal pillar and enlarged p...

Semiconductor package on package having plug-socket type wire conne...

System and method for increasing the strength of a bond made by a s...

Integrated ball and via package and formation process

System and method for increasing the strength of a bond made by a s...

Self-locking wire bond structure and method of making the same

Roughened bonding pad and bonding wire surfaces for low pressure wi...

System and method for increasing the strength of a bond made by a s...

Method of making semiconductor device

Semiconductor device, method for fabricating the semiconductor devi...

Bond pad structure and method for reduced downward force wirebonding

Semiconductor device and method of making same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

Method of Manufacturing Semiconductor Device

SHORT TAIL RECOVERY TECHNIQUES IN WIRE BONDING OPERATIONS

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...

WIREBONDING PROCESS

ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOV...

CONNECTION BY FITTING TOGETHER TWO SOLDERED INSERTS

SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE

Method and device for fabricating an assembly of at least two micro...

SEMICONDUCTOR PACKAGE ON PACKAGE HAVING PLUG-SOCKET TYPE WIRE CONNE...

System and method for increasing the strength of a bond made by a s...

Wire positioning and mechanical attachment for a radio-frequency in...

Integrated ball and via package and formation process

System and method for increasing the strength of a bond made by a s...

Roughened bonding pad and bonding wire surfaces for low pressure wi...

Self-locking wire bond structure and method of making the same

System and method for increasing the strength of a bond made by a s...

Method of making semiconductor device

Semiconductor device and method of making same

Semiconductor device, method for fabricating the semiconductor devi...