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Borides composed of metals from groups of the periodic table
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CPC
H01L2924/042
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/042
Borides composed of metals from groups of the periodic table
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Patents Grants
last 30 patents
Information
Patent Grant
Conductive lines and pads and method of manufacturing thereof
Patent number
8,586,472
Issue date
Nov 19, 2013
Infineon Technologies AG
Roland Hampp
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
Publication number
20250054888
Publication date
Feb 13, 2025
Huawei Technologies Co., Ltd
Ran He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...
Publication number
20180033760
Publication date
Feb 1, 2018
NIPPON STEEL & SUMITOMO METAL CORPORATION
Shinji ISHIKAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
Publication number
20150194398
Publication date
Jul 9, 2015
INFINEON TECHNOLOGIES AG
Roland Hampp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
Publication number
20140048940
Publication date
Feb 20, 2014
INFINEON TECHNOLOGIES AG
Roland Hampp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
Publication number
20120013011
Publication date
Jan 19, 2012
Roland Hampp
H01 - BASIC ELECTRIC ELEMENTS