Boron nitride [BN]

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H01L2924/10325

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/10325Boron nitride [BN]

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Patents Grantslast 30 patents

Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 11,710,662
- Issue date Jul 25, 2023
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 11,121,060
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 10,825,733
- Issue date Nov 3, 2020
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 10,615,100
- Issue date Apr 7, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer composite bonding materials and power electronics assemb...
- Patent number 10,381,223
- Issue date Aug 13, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having a semiconductor cooling chip an...
- Patent number 10,224,265
- Issue date Mar 5, 2019
- North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having a semiconductor cooling chip an...
- Patent number 10,032,694
- Issue date Jul 24, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having a wide bandgap semiconductor de...
- Patent number 10,020,243
- Issue date Jul 10, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 8,641,859
- Issue date Feb 4, 2014
- Thin Materials AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE
- Publication number 20210005517
- Publication date Jan 7, 2021
- UNITED SILICON CARBIDE, INC.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...
- Publication number 20200194342
- Publication date Jun 18, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE
- Publication number 20200135565
- Publication date Apr 30, 2020
- UNITED SILICON CARBIDE, INC.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMB...
- Publication number 20190164760
- Publication date May 30, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Assemblies and Cooling Structures Having Metalized Exte...
- Publication number 20180166359
- Publication date Jun 14, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING A SEMICONDUCTOR COOLING CHIP AN...
- Publication number 20170263532
- Publication date Sep 14, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20110272092
- Publication date Nov 10, 2011
- THIN MATERIALS AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Boron nitride [BN]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transient liquid phase bonding compositions and power electronics a...

Reusable wide bandgap semiconductor substrate

Electronics assemblies and cooling structures having metalized exte...

Multi-layered composite bonding materials and power electronics ass...

Reusable wide bandgap semiconductor substrate

Electronics assemblies and cooling structures having metalized exte...

Multilayer composite bonding materials and power electronics assemb...

Power electronics assemblies having a semiconductor cooling chip an...

Power electronics assemblies having a semiconductor cooling chip an...

Power electronics assemblies having a wide bandgap semiconductor de...

Method for fabricating a semiconductor package with conductive carr...

Method for fabricating a semiconductor package with conductive carr...

Bonding method

Patents Applicationslast 30 patents

REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE

ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...

REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE

MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMB...

Electronics Assemblies and Cooling Structures Having Metalized Exte...

POWER ELECTRONICS ASSEMBLIES HAVING A SEMICONDUCTOR COOLING CHIP AN...

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

BONDING METHOD