TREA

Boron phosphide [BP]

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Industry

  • CPC
  • H01L2924/10326
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10326Boron phosphide [BP]
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding method
    • Patent number 8,641,859
    • Issue date Feb 4, 2014
    • Thin Materials AG
    • Franz Richter
    • B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING METHOD
    • Publication number 20110272092
    • Publication date Nov 10, 2011
    • THIN MATERIALS AG
    • Franz Richter
    • B32 - LAYERED PRODUCTS