Both on and outside the bonding interface of the bonding area

Industry

CPC
H01L2224/05566

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05566Both on and outside the bonding interface of the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,996,433
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,594,504
- Issue date Feb 28, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,322,540
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,222,915
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,011,483
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 10,833,119
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a corresponding method of manufacturing se...
- Patent number 10,593,625
- Issue date Mar 17, 2020
- STMicroelectronics S.r.l.
- Samuele Sciarrillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallization structure
- Patent number 9,859,235
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level array of chips and method thereof
- Patent number 9,318,461
- Issue date Apr 19, 2016
- Xintec Inc.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,426,972
- Issue date Apr 23, 2013
- Toyota Jidosha Kabushiki Kaisha
- Keisuke Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball pad structure
- Patent number 7,294,929
- Issue date Nov 13, 2007
- Texas Instruments Incorporated
- Hiroshi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit module
- Patent number 5,829,125
- Issue date Nov 3, 1998
- Taiyo Yuden Co., Ltd.
- Masayuki Fujimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20240120295
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230343702
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230253412
- Publication date Aug 10, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jeong Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238400
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Lyong BOK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Backlight Unit and Display Device Including the Same
- Publication number 20230170342
- Publication date Jun 1, 2023
- LG Display Co., Ltd.
- ChangKyeong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...
- Publication number 20220367530
- Publication date Nov 17, 2022
- Ordos Yuansheng Optoelectronics Co., Ltd.
- Yongbo JU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20220254828
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NIckel Alloy for Semiconductor Packaging
- Publication number 20210242151
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20210193777
- Publication date Jun 24, 2021
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Mengmeng Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20210028219
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel Alloy for Semiconductor Packaging
- Publication number 20190259717
- Publication date Aug 22, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190027453
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- YONG HO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20180331146
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20170117316
- Publication date Apr 27, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL ARRAY OF CHIPS AND METHOD THEREOF
- Publication number 20140312482
- Publication date Oct 23, 2014
- XINTEC INC.
- Chun-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING TH...
- Publication number 20120235278
- Publication date Sep 20, 2012
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120104612
- Publication date May 3, 2012
- Toyota Jidosha Kabushiki Kaisha
- Keisuke KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underbump Metallization Structure
- Publication number 20100187687
- Publication date Jul 29, 2010
- Yu-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080217754
- Publication date Sep 11, 2008
- Kabushiki Kaisha Toshiba
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Pad Structure
- Publication number 20080026559
- Publication date Jan 31, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Hiroshi Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder ball pad structure
- Publication number 20050146030
- Publication date Jul 7, 2005
- Hiroshi Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Both on and outside the bonding interface of the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pad structure for front side illuminated image sensor

Array substrate and method for manufacturing the same, and display...

Nickel alloy for semiconductor packaging

Semiconductor structure having counductive bump with tapered portio...

Pad structure for front side illuminated image sensor

Pad structure for front side illuminated image sensor

Semiconductor structure having a conductive bump with a plurality o...

Nickel alloy for semiconductor packaging

Collars for under-bump metal structures and associated systems and...

Pad structure for front side illuminated image sensor

Semiconductor device and a corresponding method of manufacturing se...

Underbump metallization structure

Semiconductor device and method of forming bump structure with insu...

Semiconductor device and method for producing the same

Wafer level array of chips and method thereof

Semiconductor device and method of forming bump structure with insu...

Semiconductor device and method for manufacturing the same

Solder ball pad structure

Method of manufacturing circuit module

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

ELECTRONIC COMPONENT

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

DISPLAY DEVICE AND TILED DISPLAY DEVICE

Backlight Unit and Display Device Including the Same

ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

NIckel Alloy for Semiconductor Packaging

DISPLAY SUBSTRATE AND DISPLAY DEVICE

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

Nickel Alloy for Semiconductor Packaging

SEMICONDUCTOR DEVICES

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

Semiconductor Device and Method of Forming Bump Structure with Insu...

WAFER LEVEL ARRAY OF CHIPS AND METHOD THEREOF

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING TH...

Semiconductor Device and Method of Forming Bump Structure with Insu...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Underbump Metallization Structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Solder Ball Pad Structure

Solder ball pad structure