Both on and outside the bonding interface of the bump connector

Industry

CPC
H01L2224/13566

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13566Both on and outside the bonding interface of the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,741,513
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,163,836
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package including bump
- Patent number 10,157,873
- Issue date Dec 18, 2018
- SK hynix Inc.
- Jun-Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device including a pillar c...
- Patent number 9,627,339
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,559,028
- Issue date Jan 31, 2017
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure design for 3DIC testing
- Patent number 9,219,016
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a copper pillar capped by barri...
- Patent number 9,142,521
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,142,516
- Issue date Sep 22, 2015
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,117,811
- Issue date Aug 25, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structures having organic preservative films
- Patent number 9,082,680
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective layer for protecting TSV tips during thermo-compressive...
- Patent number 8,723,330
- Issue date May 13, 2014
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, fabricating method thereof and package structure
- Patent number 8,674,503
- Issue date Mar 18, 2014
- Himax Technologies Limited
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a copper pillar capped by barri...
- Patent number 8,653,659
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for protecting TSV tips during thermo-compressive...
- Patent number 8,623,763
- Issue date Jan 7, 2014
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 8,530,360
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,476,159
- Issue date Jul 2, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method
- Patent number 8,450,859
- Issue date May 28, 2013
- Panasonic Corporation
- Naomichi Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,426,984
- Issue date Apr 23, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 8,367,539
- Issue date Feb 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220328443
- Publication date Oct 13, 2022
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMP
- Publication number 20180366430
- Publication date Dec 20, 2018
- SK HYNIX INC.
- Jun-Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20180166409
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...
- Publication number 20140124924
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20130249098
- Publication date Sep 26, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Constructions Having Through Substrate Vias And...
- Publication number 20130175698
- Publication date Jul 11, 2013
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE
- Publication number 20130099359
- Publication date Apr 25, 2013
- SK HYNIX INC.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20130087906
- Publication date Apr 11, 2013
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure Design for 3DIC Testing
- Publication number 20130077272
- Publication date Mar 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
- Publication number 20130062756
- Publication date Mar 14, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
- Publication number 20130065388
- Publication date Mar 14, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130026649
- Publication date Jan 31, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Structures Having Organic Preservative Films
- Publication number 20130000978
- Publication date Jan 3, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Ju-Il Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20120306085
- Publication date Dec 6, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...
- Publication number 20120273945
- Publication date Nov 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed Pillar Structure
- Publication number 20120012997
- Publication date Jan 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CU PILLAR CAPPED BY BARRIER LAYER
- Publication number 20120007231
- Publication date Jan 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BUMP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20110291273
- Publication date Dec 1, 2011
- CHIPMOS TECHNOLOGIES INC.
- CHENG TANG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110233767
- Publication date Sep 29, 2011
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20110140269
- Publication date Jun 16, 2011
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...
- Publication number 20110143502
- Publication date Jun 16, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD
- Publication number 20110095423
- Publication date Apr 28, 2011
- Naomichi Ohashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Both on and outside the bonding interface of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive terminal for side facing packages

Conductive external connector structure and method of forming

Substrate device, electronic apparatus, and method for manufacturin...

Chip packages with sintered interconnects formed out of pads

Conductive external connector structure and method of forming

Expanded head pillar for bump bonds

Conductive external connector structure and method of forming

Semiconductor package including bump

Method of producing a hybridized device including microelectronic c...

Sintered conductive matrix material on wire bond

Transient interface gradient bonding for metal bonds

Method of forming an integrated circuit device including a pillar c...

Semiconductor device

Flip chip assembly and process with sintering material on metal bumps

Electromigration-resistant lead-free solder interconnect structures

Semiconductor device and manufacturing method therefor

Structure design for 3DIC testing

Integrated circuit device including a copper pillar capped by barri...

Semiconductor device and manufacturing method therefor

Flip chip assembly and process with sintering material on metal bumps

Joint structures having organic preservative films

Protective layer for protecting TSV tips during thermo-compressive...

Circuit board, fabricating method thereof and package structure

Integrated circuit device including a copper pillar capped by barri...

Protective layer for protecting TSV tips during thermo-compressive...

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Substrate structure with compliant bump and manufacturing method th...

Semiconductor device mounted structure and its manufacturing method

Substrate structure with compliant bump and manufacturing method th...

Semiconductor device and semiconductor device manufacturing method

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

EXPANDED HEAD PILLAR FOR BUMP BONDS

SEMICONDUCTOR PACKAGE INCLUDING BUMP

Conductive External Connector Structure and Method of Forming

INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

Integrated Circuit Constructions Having Through Substrate Vias And...

SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE

CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE

Structure Design for 3DIC Testing

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Joint Structures Having Organic Preservative Films

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...

Recessed Pillar Structure

METHOD OF FORMING CU PILLAR CAPPED BY BARRIER LAYER

CHIP BUMP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device and method for manufacturing the same

Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD