Bump and strap connectors

Follow

Industry

CPC
H01L2224/73205

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73205Bump and strap connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package comprising chip contact element of two different electrical...
- Patent number 11,056,458
- Issue date Jul 6, 2021
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding structure in InFO package
- Patent number 10,950,556
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module semiconductor devices
- Patent number 6,919,643
- Issue date Jul 19, 2005
- Koninklijke Philips Electronics N.V.
- Nicolas J. Wheeler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D GATE CONTROL CONNECTION OF A POWER MODULE WITH AT LEAST ONE CONT...
- Publication number 20240339434
- Publication date Oct 10, 2024
- II-VI Delaware, Inc.
- Erno TEMESI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...
- Publication number 20200176412
- Publication date Jun 4, 2020
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module semiconductor devices
- Publication number 20030098468
- Publication date May 29, 2003
- Koninklijke Philips Electronics
- Nicolas J. Wheeler
- H01 - BASIC ELECTRIC ELEMENTS