Bump and TAB connectors

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H01L2224/73211

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73211Bump and TAB connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,622,311
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,529,665
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,744,859
- Issue date Apr 28, 1998
- Texas Instruments Incorporated
- Takayuki Ouchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tape automated bonding element
- Patent number 5,731,631
- Issue date Mar 24, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yomiyuki Yama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE
- Publication number 20210296280
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
- Publication number 20190051603
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
- Publication number 20190051605
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Publication number 20150187731
- Publication date Jul 2, 2015
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS