Bump collar

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CPC
H01L2224/10126

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/10126Bump collar

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package for stress sensitive component and semiconductor device
- Patent number 12,074,134
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,967,573
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,742,310
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having passivation layer and method of manufac...
- Patent number 11,605,579
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,581,276
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,469,200
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,177,355
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with protected bump and method of fo...
- Patent number 11,171,100
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 11,081,391
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,081,459
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,037,849
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including solder bracing material with a rough...
- Patent number 11,018,106
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 11,018,103
- Issue date May 25, 2021
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and fabricating method thereof
- Patent number 10,985,121
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,978,346
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 10,872,850
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SOLID STATE ARRAY
- Publication number 20240413134
- Publication date Dec 12, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SOLID STATE ARRAY
- Publication number 20240395778
- Publication date Nov 28, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SOLID STATE ARRAY
- Publication number 20240395779
- Publication date Nov 28, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379604
- Publication date Nov 14, 2024
- Samsung Electronics Co., LTD
- Jihyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...
- Publication number 20240274558
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230317658
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223368
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20230215825
- Publication date Jul 6, 2023
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layers And Methods Of Fabricating The Same In Semico...
- Publication number 20230187392
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
- Publication number 20230106976
- Publication date Apr 6, 2023
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20230005881
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305116
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210257326
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...
- Publication number 20210159197
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210111139
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layers And Methods Of Fabricating The Same In Semico...
- Publication number 20210098400
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20210091020
- Publication date Mar 25, 2021
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082849
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bump Formation Process
- Publication number 20200126937
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...
- Publication number 20200091059
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20200083188
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075449
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS

Bump collar

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package for stress sensitive component and semiconductor device

Chip package structure

Method of manufacturing substrate structure with filling material f...

Redistribution layers and methods of fabricating the same in semico...

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor structure and manufacturing method thereof

Metal pad modification

Method of manufacturing semiconductor device

Semiconductor device having passivation layer and method of manufac...

Redistribution layers and methods of fabricating the same in semico...

Semiconductor device and manufacturing method thereof

Chip package structure

Semiconductor device and bump formation process

Semiconductor chip with patterned underbump metallization and polym...

Barrier structures between external electrical connectors

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor structure and manufacturing method thereof

Semiconductor device structure with protected bump and method of fo...

Methods for bump planarity control

Packaged semiconductor devices and methods of packaging thereof

Wafer level dicing method and semiconductor device

Semiconductor device

Interconnect structures and methods of forming same

Semiconductor structure and manufacturing method thereof

Semiconductor device including solder bracing material with a rough...

Integrated circuit structure

Bump structure and fabricating method thereof

Conductive vias in semiconductor packages and methods of forming same

Collars for under-bump metal structures and associated systems and...

Package structure and method of forming thereof

Patents Applicationslast 30 patents

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

OPTOELECTRONIC SOLID STATE ARRAY

OPTOELECTRONIC SOLID STATE ARRAY

OPTOELECTRONIC SOLID STATE ARRAY

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

FLIP CHIP PACKAGE ASSEMBLY

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

Redistribution Layers And Methods Of Fabricating The Same In Semico...

SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

Redistribution Layers And Methods Of Fabricating The Same In Semico...

INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE

Interconnect Structures and Methods of Forming Same

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Device and Bump Formation Process

METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF