Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body

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H01L2224/13008

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13008Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,435
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating wafers with electrical contacts on a surface parallel t...
- Patent number 12,009,352
- Issue date Jun 11, 2024
- Illumina, Inc.
- Arvin Emadi
- G01 - MEASURING TESTING
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,984,420
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,961,812
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,928
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit structure
- Patent number 11,610,857
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,587,898
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,783
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-metal-solder stack for electronic interconnect
- Patent number 11,239,190
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer-printable flip-chip structures and methods
- Patent number 10,964,583
- Issue date Mar 30, 2021
- X Display Company Technology Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,818,621
- Issue date Oct 27, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure having elastic bump
- Patent number 10,580,665
- Issue date Mar 3, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed repassivation for wafer chip scale packaging
- Patent number 10,541,220
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer-printable flip-chip structures and methods
- Patent number 10,431,487
- Issue date Oct 1, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,283,377
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust pillar structure for semicondcutor device contacts
- Patent number 10,236,268
- Issue date Mar 19, 2019
- Amkor Technology, Inc.
- Karthikeyan Dhandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P—N separation metal fill for flip chip LEDs
- Patent number 10,170,675
- Issue date Jan 1, 2019
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,163,735
- Issue date Dec 25, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,103,069
- Issue date Oct 16, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 10,068,887
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,978,705
- Issue date May 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 9,786,515
- Issue date Oct 10, 2017
- NXP USA, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-n separation metal fill for flip chip LEDs
- Patent number 9,722,161
- Issue date Aug 1, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming openings and trenches i...
- Patent number 9,607,958
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240413069
- Publication date Dec 12, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266309
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240222284
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Bongju CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD...
- Publication number 20230352451
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
- Publication number 20230207508
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102285
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069490
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230062136
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220367320
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Hojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Integration with Redistribution Layer
- Publication number 20220246565
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL T...
- Publication number 20220216191
- Publication date Jul 7, 2022
- Illumina, Inc.
- Arvin EMADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT STRUCTURE
- Publication number 20210407946
- Publication date Dec 30, 2021
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305189
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-METAL-SOLDER STACK FOR ELECTRONIC INTERCONNECT
- Publication number 20210217718
- Publication date Jul 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
- Publication number 20210143118
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200251435
- Publication date Aug 6, 2020
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200185293
- Publication date Jun 11, 2020
- Stefan Schmalzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
- Publication number 20200043878
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139787
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20180374836
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20170373235
- Publication date Dec 28, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170278812
- Publication date Sep 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS

Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump integration with redistribution layer

Semiconductor package

Fabricating wafers with electrical contacts on a surface parallel t...

Packaged die and RDL with bonding structures therebetween

Semiconductor device

Semiconductor packages having vias

Semiconductor package and manufacturing method thereof

Packaged die and RDL with bonding structures therebetween

Method of manufacturing circuit structure

Semiconductor packages having vias

Semiconductor device

Solder-metal-solder stack for electronic interconnect

Packaged die and RDL with bonding structures therebetween

Micro-transfer-printable flip-chip structures and methods

Fan-out semiconductor package

Method for manufacturing package structure having elastic bump

Printed repassivation for wafer chip scale packaging

Micro-transfer-printable flip-chip structures and methods

Integrated fan-out package and manufacturing method thereof

Robust pillar structure for semicondcutor device contacts

P—N separation metal fill for flip chip LEDs

Pressure-activated electrical interconnection by micro-transfer pri...

Pressure-activated electrical interconnection by micro-transfer pri...

Semiconductor packages and methods of forming the same

Semiconductor substrate and semiconductor package structure having...

Semiconductor device package and methods of manufacture thereof

P-n separation metal fill for flip chip LEDs

Semiconductor device

Semiconductor device and method for forming openings and trenches i...

Electronic component-mounted structure, IC card and COF package

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SEMICONDUCTOR PACKAGES HAVING VIAS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Bump Integration with Redistribution Layer

FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL T...

METHOD OF MANUFACTURING CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SOLDER-METAL-SOLDER STACK FOR ELECTRONIC INTERCONNECT

SEMICONDUCTOR PACKAGES HAVING VIAS

CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package Having a Laser-Activatable Mold Compound

PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Packages and Methods of Forming the Same

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

FAN-OUT SEMICONDUCTOR PACKAGE