Bump connector smaller than the underlying bonding area

Industry

CPC
H01L2224/13007

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13007Bump connector smaller than the underlying bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
- Patent number 11,894,353
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component and package structure having the same
- Patent number 11,869,819
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having passivation layer and method of manufac...
- Patent number 11,605,579
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,545,451
- Issue date Jan 3, 2023
- Nepes Co., Ltd.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 11,532,524
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including substrate with outer insulating layer
- Patent number 11,508,649
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component and package structure having the same
- Patent number 11,450,579
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias using silicon on insulator substrate
- Patent number 11,257,744
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Toshiyuki Maenosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a step film formed betw...
- Patent number 11,245,013
- Issue date Feb 8, 2022
- Fuji Electric Co., Ltd.
- Yuichi Hashizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 11,217,548
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with UBM and methods of forming
- Patent number 11,164,832
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bump structure
- Patent number 11,145,613
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
- Publication number 20240321795
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240243028
- Publication date Jul 18, 2024
- Innolux Corporation
- Ming-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222303
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240203833
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jungil SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DELIVERY NETWORK
- Publication number 20240186248
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105656
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
- Publication number 20240105655
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240087967
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL PADS
- Publication number 20240088072
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Tsung Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047398
- Publication date Feb 8, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240047305
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Seungha OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
- Publication number 20240038704
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS
- Publication number 20240038703
- Publication date Feb 1, 2024
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030145
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIA IN PHOTOSENSITIVE MODULE
- Publication number 20240021649
- Publication date Jan 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ming-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF
- Publication number 20230369268
- Publication date Nov 16, 2023
- Siliconware Precision Industries Co., Ltd.
- Yung-Ta Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230326893
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Sangho CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230170318
- Publication date Jun 1, 2023
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230091632
- Publication date Mar 23, 2023
- Rohm Co., Ltd.
- Satoshi KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20230054495
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230039094
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Moonyong JANG
- H01 - BASIC ELECTRIC ELEMENTS

Bump connector smaller than the underlying bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Semiconductor devices and preparation methods thereof

Semiconductor device assembly with surface-mount die support struct...

Die attach surface copper layer with protective layer for microelec...

Method for forming conductive layer, and conductive structure and f...

Solder ball application for singular die

Driving substrate and manufacturing method thereof, and micro LED b...

Integrated circuit component and package structure having the same

Semiconductor package

Connector structure and method of forming same

Semiconductor chip with reduced pitch conductive pillars

Semiconductor device having passivation layer and method of manufac...

Semiconductor package

Integrated circuit test method and structure thereof

Semiconductor package including substrate with outer insulating layer

Solder ball application for singular die

Semiconductor structure having counductive bump with tapered portio...

Integrated circuit component and package structure having the same

Polymer layers embedded with metal pads for heat dissipation

Semiconductor packages and methods of forming same

Method of forming vias using silicon on insulator substrate

Silicon carbide semiconductor device having a step film formed betw...

Semiconductor device structure and manufacturing method

Package with UBM and methods of forming

Semiconductor wafer and method of ball drop on thin wafer with edge...

Micro-connection structure and manufacturing method thereof

Method for forming bump structure

Fan-out interconnect structure and method for forming same

Fine pitch copper pillar package and method

Semiconductor structure having a conductive bump with a plurality o...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

SEMICONDUCTOR STRUCTURE

DISPLAY DEVICE

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME

BACKSIDE POWER DELIVERY NETWORK

PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

EMBEDDED METAL PADS

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...

SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS

SEMICONDUCTOR PACKAGE

THROUGH-SUBSTRATE-VIA IN PHOTOSENSITIVE MODULE

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

Solder Ball Application for Singular Die

SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...