Bump connectors ; Manufacturing methods related thereto

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/10Bump connectors ; Manufacturing methods related thereto

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device
- Patent number 12,159,812
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Lung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package with trench to reduce slippage and display dev...
- Patent number 12,148,337
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including connecting pad and conductive portion
- Patent number 12,094,845
- Issue date Sep 17, 2024
- Innolux Corporation
- Jia-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna system and antenna combination architecture
- Patent number 12,062,844
- Issue date Aug 13, 2024
- ASUSTeK COMPUTER Inc.
- Cheng-Tse Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backmetal and related methods
- Patent number 12,040,295
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for underfilling using spacers
- Patent number 11,948,809
- Issue date Apr 2, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate having metal post offset from conductor pad and me...
- Patent number 11,935,822
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-use package architecture
- Patent number 11,929,295
- Issue date Mar 12, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid micro-bump integration with redistribution layer
- Patent number 11,855,028
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 11,837,563
- Issue date Dec 5, 2023
- Innolux Corporation
- Jia-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,830,746
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for inspecting integrated circuits based on X-rays
- Patent number 11,815,349
- Issue date Nov 14, 2023
- Bruker Nano, Inc.
- Brennan Lovelace Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 11,676,889
- Issue date Jun 13, 2023
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package and printed circuit board attachment
- Patent number 11,610,827
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contactless high-frequency interconnect
- Patent number 11,581,272
- Issue date Feb 14, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 11,557,516
- Issue date Jan 17, 2023
- Adeia Semiconductor Inc.
- Javier DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,521,925
- Issue date Dec 6, 2022
- Fuji Electric Co., Ltd.
- Akira Hirao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240421110
- Publication date Dec 19, 2024
- InnoLux Corporation
- Jia-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240379605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacaturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT
- Publication number 20240204048
- Publication date Jun 20, 2024
- Intel Corporation
- Hwichan Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC STRUCTURE AND DATA COMMUNICATION BETWEEN COMP...
- Publication number 20240105676
- Publication date Mar 28, 2024
- ZERO EC SA
- Erez HALAHMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240063157
- Publication date Feb 22, 2024
- InnoLux Corporation
- Jia-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS
- Publication number 20240038703
- Publication date Feb 1, 2024
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20230260884
- Publication date Aug 17, 2023
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and Printed Circuit Board Attachment
- Publication number 20230230891
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...
- Publication number 20230197632
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20230137580
- Publication date May 4, 2023
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY PANEL
- Publication number 20230112423
- Publication date Apr 13, 2023
- PlayNitride Display Co., Ltd.
- Shiang-Ning YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR UNDERFILLING USING SPACERS
- Publication number 20230082626
- Publication date Mar 16, 2023
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230052793
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hae Yun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...
- Publication number 20220415834
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun BOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
- Publication number 20220373593
- Publication date Nov 24, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20220367397
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20220336305
- Publication date Oct 20, 2022
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS

Bump connectors ; Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming semiconductor device

Chip on film package with trench to reduce slippage and display dev...

Guard ring design enabling in-line testing of silicon bridges for s...

3D chip with shared clock distribution network

Electronic device including connecting pad and conductive portion

Semiconductor die contact structure and method

Antenna system and antenna combination architecture

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with backmetal and related methods

Stackable via package and method

Method for underfilling using spacers

Wiring substrate having metal post offset from conductor pad and me...

Multi-use package architecture

Semiconductor device having electrode pads arranged between groups...

Hybrid micro-bump integration with redistribution layer

Shielding structures

Electronic device and method for manufacturing electronic device

Semiconductor device and method of manufacture

Semiconductor package

Methods and systems for inspecting integrated circuits based on X-rays

Semiconductor package

Hybrid under-bump metallization component

Stackable via package and method

Guard ring design enabling in-line testing of silicon bridges for s...

Adhesive for semiconductor device, and high productivity method for...

Package and printed circuit board attachment

Contactless high-frequency interconnect

3D chip with shared clock distribution network

Semiconductor device comprising semiconductor die and interposer an...

Semiconductor module

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

INTEGRATED ELECTRONIC STRUCTURE AND DATA COMMUNICATION BETWEEN COMP...

ELECTRONIC DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

STACKABLE VIA PACKAGE AND METHOD

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

Package and Printed Circuit Board Attachment

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

MICRO LED DISPLAY PANEL

Semiconductor Die Contact Structure and Method

METHOD FOR UNDERFILLING USING SPACERS

DISPLAY DEVICE

METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...

SECURITY CIRCUITRY FOR BONDED STRUCTURES

Metal-Bump Sidewall Protection

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...