TREA

Bump or bump-like direct electrical connections from device to substrate

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Industry

  • CPC
  • H01L2225/06517
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06517Bump or bump-like direct electrical connections from device to substrate
Industries