by affixing prefabricated conductor pattern

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CPC
H05K3/20

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/20by affixing prefabricated conductor pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for transfer printing of films
- Patent number 12,167,541
- Issue date Dec 10, 2024
- University of Virginia Patent Foundation
- Baoxing Xu
- B44 - DECORATIVE ARTS
Information Patent Grant
Extensible and contractible wiring board and method for manufacturi...
- Patent number 12,133,326
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring micro device on curved surface and apparatu...
- Patent number 12,127,349
- Issue date Oct 22, 2024
- Korea Institute of Machinery & Materials
- Bongkyun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch sensor and method for making the same
- Patent number 12,093,476
- Issue date Sep 17, 2024
- NUOVO FILM SUZHOU CHINA INC.
- Biao Deng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RFID antenna, RFID tag and method for fabricating such RFID antenna
- Patent number 12,073,277
- Issue date Aug 27, 2024
- International Imaging Materials, Inc.
- Daniel J. Harrison
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 12,028,989
- Issue date Jul 2, 2024
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, electronic apparatus, and wiring connection method
- Patent number 12,010,791
- Issue date Jun 11, 2024
- Sony Group Corporation
- Hiroshi Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extensible and contractible wiring board and method for manufacturi...
- Patent number 11,785,714
- Issue date Oct 10, 2023
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tube lamp with leadframe
- Patent number 11,757,081
- Issue date Sep 12, 2023
- LEDVANCE GmbH
- Bernhard Rieder
- F21 - LIGHTING
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing insulating circuit substrate with heat sink
- Patent number 11,735,434
- Issue date Aug 22, 2023
- Mitsubishi Materials Corporation
- Ryouhei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing untethered, stretchable, and wearable electroni...
- Patent number 11,729,904
- Issue date Aug 15, 2023
- Carnegie Mellon University
- Eric J. Markvicka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic copper circuit board and method for manufacturing the same
- Patent number 11,653,447
- Issue date May 16, 2023
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID ANTENNA, RFID TAG AND METHOD FOR FABRICATING SUCH RFID ANTENNA
- Publication number 20240249108
- Publication date Jul 25, 2024
- International Imaging Materials, Inc.
- Daniel J. HARRISON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR INTRODUCING A SUBSTRATE INTO A NIP
- Publication number 20240173954
- Publication date May 30, 2024
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...
- Publication number 20240155774
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20240130047
- Publication date Apr 18, 2024
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TAPE ASSEMBLY FOR A SMART CATHETER
- Publication number 20240115832
- Publication date Apr 11, 2024
- FREUDENBERG MEDICAL, LLC
- Timothy S. ZEIS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WIRING MODULE
- Publication number 20240107663
- Publication date Mar 28, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shinichiro YOSHIDA
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE TAPE WITH MONOLAYERED CONDUCTIVE PRESSURE S...
- Publication number 20240084176
- Publication date Mar 14, 2024
- 3M Innovative Properties Company
- Junbeom Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING TRANSIENT ELECTRONICS
- Publication number 20240080991
- Publication date Mar 7, 2024
- Accenture Global Solutions Limited
- Tingyu Cheng
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE,...
- Publication number 20240023234
- Publication date Jan 18, 2024
- NHK Spring Co., Ltd.
- Shinya YANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD
- Publication number 20240015892
- Publication date Jan 11, 2024
- Primax Electronics Ltd.
- Yi-Te Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20230397342
- Publication date Dec 7, 2023
- Shinko Electric Industries Co., Ltd.
- Masayuki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20230337358
- Publication date Oct 19, 2023
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20230292445
- Publication date Sep 14, 2023
- LANDA LABS (2012) LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230276577
- Publication date Aug 31, 2023
- IBIDEN CO., LTD.
- Yasushi USAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCT...
- Publication number 20230234333
- Publication date Jul 27, 2023
- Showa Denko Materials Co., Ltd.
- Takashi NAKAZAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS
- Publication number 20230225058
- Publication date Jul 13, 2023
- DUPONT SAFETY & CONSTRUCTION, INC.
- Timothy Scott Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN TRANSFER OF HIGH VISCOSITY MATERIAL
- Publication number 20230209722
- Publication date Jun 29, 2023
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD TH...
- Publication number 20230203691
- Publication date Jun 29, 2023
- Circuit Foil Luxembourg
- Honggi MOON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Application of Electrical Conductors of a Solar Cell
- Publication number 20230129839
- Publication date Apr 27, 2023
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REEL-TO-REEL SURFACE PRESS APPARATUS
- Publication number 20230094795
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Yong Nam Kim
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD FOR APPLYING A PATTERN TO A SUBSTRATE
- Publication number 20230087822
- Publication date Mar 23, 2023
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR TRANSFER PRINTING OF FILMS
- Publication number 20230051993
- Publication date Feb 16, 2023
- University of Virginia Patent Foundation
- Baoxing Xu
- B44 - DECORATIVE ARTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230037560
- Publication date Feb 9, 2023
- InnoLux Corporation
- Wei-Cheng CHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BODY, PATTERN PLATE, AND WIRING BODY
- Publication number 20230004243
- Publication date Jan 5, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAYOSHI NIRENGI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE, ELECTRONIC APPARATUS, AND WIRING CONNECTION METHOD
- Publication number 20220394846
- Publication date Dec 8, 2022
- SONY GROUP CORPORATION
- HIROSHI KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD
- Publication number 20220386474
- Publication date Dec 1, 2022
- Canatu Oy
- Ilkka VARJOS
- G06 - COMPUTING CALCULATING COUNTING

by affixing prefabricated conductor pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a ceramic copper circuit board

Printed circuit board

Method and system for transfer printing of films

Extensible and contractible wiring board and method for manufacturi...

Patterned article including electrically conductive elements

Insulated circuit substrate manufacturing method

Method for transferring micro device on curved surface and apparatu...

Ceramic substrate manufacturing method

Touch sensor and method for making the same

Manufacturing method of insulated metal substrate

Panel molded electronic assemblies with multi-surface conductive co...

Layered device for pressure treatment and method

RFID antenna, RFID tag and method for fabricating such RFID antenna

Method for manufacturing microelectrode film

Patterned conductive article

Methods of forming flexible interconnect circuits

Method for manufacturing wiring board, and wiring board

Device, electronic apparatus, and wiring connection method

Methods of forming interconnect circuits

Low cost panel AESA with thermal management

Application of electrical conductors of a solar cell

Application of electrical conductors to an electrically insulating...

Circuit board structure and method for manufacturing a circuit boar...

Extensible and contractible wiring board and method for manufacturi...

Tube lamp with leadframe

Method for applying a pattern to a substrate

Method for producing insulating circuit substrate with heat sink

Method of producing untethered, stretchable, and wearable electroni...

Ceramic copper circuit board and method for manufacturing the same

Circuit board

Patents Applicationslast 30 patents

PATTERNED CONDUCTIVE ARTICLE

Interconnect Circuit Methods And Devices

RFID ANTENNA, RFID TAG AND METHOD FOR FABRICATING SUCH RFID ANTENNA

SYSTEM FOR INTRODUCING A SUBSTRATE INTO A NIP

WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

TAPE ASSEMBLY FOR A SMART CATHETER

WIRING MODULE

INTERCONNECT CIRCUIT METHODS AND DEVICES

ELECTRICALLY CONDUCTIVE TAPE WITH MONOLAYERED CONDUCTIVE PRESSURE S...

METHOD OF MANUFACTURING TRANSIENT ELECTRONICS

CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE,...

MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCT...

METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS

PATTERN TRANSFER OF HIGH VISCOSITY MATERIAL

DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD TH...

Application of Electrical Conductors of a Solar Cell

REEL-TO-REEL SURFACE PRESS APPARATUS

METHOD FOR APPLYING A PATTERN TO A SUBSTRATE

METHOD AND SYSTEM FOR TRANSFER PRINTING OF FILMS

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING WIRING BODY, PATTERN PLATE, AND WIRING BODY

DEVICE, ELECTRONIC APPARATUS, AND WIRING CONNECTION METHOD

LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD