by applying an insulating layer around previously made via studs

Industry

CPC
H05K3/4647

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4647by applying an insulating layer around previously made via studs

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composite layer circuit element and manufacturing method thereof
- Patent number 11,764,077
- Issue date Sep 19, 2023
- INNOLUX CORPORATION
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a three dimensionally printed wiring struc...
- Patent number 11,388,824
- Issue date Jul 12, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing resin multilayer board
- Patent number 11,212,923
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Jun Wakiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,140,785
- Issue date Oct 5, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multl-phase layered busbar for conducting electric energy wherein t...
- Patent number 11,070,036
- Issue date Jul 20, 2021
- ABB Schweiz AG
- Rudi Velthuis
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-phase busbar for conducting electric energy and method of man...
- Patent number 10,790,643
- Issue date Sep 29, 2020
- ABB Schweiz AG
- Rudi Velthuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of double layer circuit board
- Patent number 10,779,418
- Issue date Sep 15, 2020
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Landless multilayer circuit board and manufacturing method thereof
- Patent number 10,779,405
- Issue date Sep 15, 2020
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, semiconductor device including the same, and manufac...
- Patent number 10,772,205
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of composite substrate
- Patent number 10,743,423
- Issue date Aug 11, 2020
- AZOTEK CO., LTD.
- Hung-Jung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate, method of manufacturing the same, and...
- Patent number 10,707,172
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Hiroshi Somada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,667,406
- Issue date May 26, 2020
- Unimicron Technology Corp.
- Cheng-Chieh Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,645,813
- Issue date May 5, 2020
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,616,992
- Issue date Apr 7, 2020
- Unimicron Technology Corp.
- Yin-Ju Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polymer frame for a chip, such that the frame comprises at least on...
- Patent number 10,446,335
- Issue date Oct 15, 2019
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Double layer circuit board
- Patent number 10,440,836
- Issue date Oct 8, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of double layer circuit board
- Patent number 10,440,837
- Issue date Oct 8, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laminated substrate and method of manufacturing laminated substrate
- Patent number 10,398,026
- Issue date Aug 27, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akihito Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,314,168
- Issue date Jun 4, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing stacked mounting structure
- Patent number 10,244,639
- Issue date Mar 26, 2019
- Olympus Corporation
- Mikio Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 10,211,139
- Issue date Feb 19, 2019
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,187,998
- Issue date Jan 22, 2019
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Landless via concept
- Patent number 10,182,494
- Issue date Jan 15, 2019
- Flex Ltd.
- Henrik Jacobbson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package substrate with metal on conductive...
- Patent number 10,117,340
- Issue date Oct 30, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating packaging substrate
- Patent number 10,076,039
- Issue date Sep 11, 2018
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,051,736
- Issue date Aug 14, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package having pin up interconnect
- Patent number 10,049,935
- Issue date Aug 14, 2018
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
- Patent number 10,032,646
- Issue date Jul 24, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040698
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Min AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LAYER CIRCUIT ELEMENT
- Publication number 20230377904
- Publication date Nov 23, 2023
- InnoLux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...
- Publication number 20230008736
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220078910
- Publication date Mar 10, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Byeung Kyu PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAT-WIRE COPPER VERTICAL LAUNCH MICROWAVE INTERCONNECTION METHOD
- Publication number 20200367357
- Publication date Nov 19, 2020
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200305289
- Publication date Sep 24, 2020
- PHOENIX & CORPORATION
- Chun-Hsien Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200113064
- Publication date Apr 9, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF DOUBLE LAYER CIRCUIT BOARD
- Publication number 20190387631
- Publication date Dec 19, 2019
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ZERO-MISALIGNMENT VIA-PAD STRUCTURES
- Publication number 20190150291
- Publication date May 16, 2019
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124768
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having a Three Dimensionally Printed Wiring Struc...
- Publication number 20190110367
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE
- Publication number 20190104611
- Publication date Apr 4, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akihito GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING RESIN MULTILAYER BOARD
- Publication number 20190090361
- Publication date Mar 21, 2019
- Murata Manufacturing Co., Ltd.
- Jun WAKIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190021171
- Publication date Jan 17, 2019
- Unimicron Technology Corp.
- Cheng-Chieh CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LANDLESS MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20180332706
- Publication date Nov 15, 2018
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE...
- Publication number 20180255651
- Publication date Sep 6, 2018
- Phoenix Pioneer technology Co.,Ltd.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS
- Publication number 20180213655
- Publication date Jul 26, 2018
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...
- Publication number 20180146559
- Publication date May 24, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180116056
- Publication date Apr 26, 2018
- Unimicron Technology Corp.
- Yin-Ju CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180098435
- Publication date Apr 5, 2018
- Unimicron Technology Corp.
- Cheng-Chieh CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180092219
- Publication date Mar 29, 2018
- Unimicron Technology Corp.
- Cheng-Chieh CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180047662
- Publication date Feb 15, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates with Ultra Fine Pitch Flip Chip Bumps
- Publication number 20170374747
- Publication date Dec 28, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR COMPOSITION INK, LAMINATED WIRING MEMBER, SEMICONDUCTOR E...
- Publication number 20170358461
- Publication date Dec 14, 2017
- Idemitsu Kosan Co., Ltd.
- Naoki KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZERO-MISALIGNMENT VIA-PAD STRUCTURES
- Publication number 20170280568
- Publication date Sep 28, 2017
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170215282
- Publication date Jul 27, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20170135205
- Publication date May 11, 2017
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170064825
- Publication date Mar 2, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170034925
- Publication date Feb 2, 2017
- Unimicron Technology Corp.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS

by applying an insulating layer around previously made via studs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composite layer circuit element and manufacturing method thereof

Component carrier having a three dimensionally printed wiring struc...

Ceramic wiring board and method for producing the same

Method for producing resin multilayer board

Flexible printed circuit board

Multl-phase layered busbar for conducting electric energy wherein t...

Multi-phase busbar for conducting electric energy and method of man...

Manufacturing method of double layer circuit board

Landless multilayer circuit board and manufacturing method thereof

Substrates with ultra fine pitch flip chip bumps

Circuit board, semiconductor device including the same, and manufac...

Manufacturing method of composite substrate

Component-embedded substrate, method of manufacturing the same, and...

Circuit board and method for manufacturing the same

Zero-misalignment via-pad structures

Circuit board and method for manufacturing the same

Polymer frame for a chip, such that the frame comprises at least on...

Double layer circuit board

Manufacturing method of double layer circuit board

Laminated substrate and method of manufacturing laminated substrate

Printed wiring board

Method of manufacturing stacked mounting structure

Chip package structure

Zero-misalignment via-pad structures

Landless via concept

Manufacturing method of package substrate with metal on conductive...

Method of fabricating packaging substrate

Printed wiring board and method for manufacturing printed wiring board

Integrated circuit package having pin up interconnect

Robust multi-layer wiring elements and assemblies with embedded mic...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

COMPOSITE LAYER CIRCUIT ELEMENT

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

FLAT-WIRE COPPER VERTICAL LAUNCH MICROWAVE INTERCONNECTION METHOD

FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

FLEXIBLE PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF DOUBLE LAYER CIRCUIT BOARD

ZERO-MISALIGNMENT VIA-PAD STRUCTURES

PRINTED WIRING BOARD

Component Carrier Having a Three Dimensionally Printed Wiring Struc...

LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE

METHOD FOR PRODUCING RESIN MULTILAYER BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

LANDLESS MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE...

ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS

METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Substrates with Ultra Fine Pitch Flip Chip Bumps

CONDUCTOR COMPOSITION INK, LAMINATED WIRING MEMBER, SEMICONDUCTOR E...

ZERO-MISALIGNMENT VIA-PAD STRUCTURES

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CERAMIC WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME