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H01L2224/11614

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11614by chemical means only

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated pillar dies having integrated electromagnetic shield layers
- Patent number 11,694,970
- Issue date Jul 4, 2023
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,545,455
- Issue date Jan 3, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, method for producing the same, endosco...
- Patent number 11,444,049
- Issue date Sep 13, 2022
- Sony Corporation
- Osamu Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a solder bump on a substrate surface
- Patent number 11,309,269
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Arnaud Garnier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 11,158,593
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for power metallization in semiconductor devices
- Patent number 11,127,693
- Issue date Sep 21, 2021
- Infineon Technologies AG
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,106
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,081,460
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with pillar-shaped components
- Patent number 10,957,638
- Issue date Mar 23, 2021
- Lapis Semiconductor Co., Ltd.
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing compliant bump
- Patent number 10,825,788
- Issue date Nov 3, 2020
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,777,522
- Issue date Sep 15, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with compressive interlayer
- Patent number 10,700,019
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Marianne Mataln
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with compressive interlayer
- Patent number 10,658,309
- Issue date May 19, 2020
- Infineon Technologies AG
- Marianne Mataln
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 10,643,964
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of interconnect for high density 2.5D and 3D integration
- Patent number 10,593,638
- Issue date Mar 17, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with pillar-shaped components
- Patent number 10,424,537
- Issue date Sep 24, 2019
- Lapis Semiconductor Co., Ltd.
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20230115986
- Publication date Apr 13, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER
- Publication number 20230054800
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Kengo YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED PILLAR DIES HAVING INTEGRATED ELECTROMAGNETIC SHIELD LAYERS
- Publication number 20220302042
- Publication date Sep 22, 2022
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...
- Publication number 20220139858
- Publication date May 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...
- Publication number 20220068873
- Publication date Mar 3, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangcai YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20210343670
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210134749
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SOLDER BUMP ON A SUBSTRATE SURFACE
- Publication number 20210074659
- Publication date Mar 11, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Arnaud GARNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20200381383
- Publication date Dec 3, 2020
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COMPLIANT BUMP
- Publication number 20200266164
- Publication date Aug 20, 2020
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...
- Publication number 20200227369
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...
- Publication number 20200219836
- Publication date Jul 9, 2020
- SONY CORPORATION
- Osamu MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200211991
- Publication date Jul 2, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20200211993
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier for Power Metallization in Semiconductor Devices
- Publication number 20200111754
- Publication date Apr 9, 2020
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE
- Publication number 20200006271
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH PILLAR-SHAPED COMPONENTS
- Publication number 20190363041
- Publication date Nov 28, 2019
- LAPIS Semiconductor Co., Ltd.
- OSAMU KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Compressive Interlayer
- Publication number 20190273050
- Publication date Sep 5, 2019
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190189577
- Publication date Jun 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY EXTENDED CONDUCTIVE BUMP BUFFER
- Publication number 20190088610
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hsiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compressive Interlayer Having a Defined Crack-Stop Edge Extension
- Publication number 20190067209
- Publication date Feb 28, 2019
- INFINEON TECHNOLOGIES AG
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...
- Publication number 20180331170
- Publication date Nov 15, 2018
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., L TD
- Kui XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by chemical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with a barrier layer

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Methods and systems for manufacturing pillar structures on semicond...

Plated pillar dies having integrated electromagnetic shield layers

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Method for forming package structure with a barrier layer

Electronic component module, method for producing the same, endosco...

Pillar bump with noble metal seed layer for advanced heterogeneous...

Method for producing a solder bump on a substrate surface

Method of making a pillar structure having a non-metal sidewall pro...

Wafer level integration including design/co-design, structure proce...

Designs and methods for conductive bumps

Structures for bonding a group III-V device to a substrate by stack...

Barrier for power metallization in semiconductor devices

Integrated circuit package and method

Methods and systems for manufacturing pillar structures on semicond...

Semiconductor device and method for manufacturing the same

Device with pillar-shaped components

Method for manufacturing compliant bump

Package structure with a barrier layer and method for forming the same

Protrusion bump pads for bond-on-trace processing

Semiconductor devices and semiconductor devices including a redistr...

Semiconductor structure and method of manufacturing the same

Semiconductor device with compressive interlayer

Semiconductor device with compressive interlayer

Structures for bonding a group III-V device to a substrate by stack...

Expanded head pillar for bump bonds

Methods of interconnect for high density 2.5D and 3D integration

Wafer level integration including design/co-design, structure proce...

Device with pillar-shaped components

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH A BARRIER LAYER

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

WAFER

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

PLATED PILLAR DIES HAVING INTEGRATED ELECTROMAGNETIC SHIELD LAYERS

PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...

BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

Integrated Circuit Package and Method

METHOD FOR PRODUCING A SOLDER BUMP ON A SUBSTRATE SURFACE

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

METHOD FOR MANUFACTURING COMPLIANT BUMP

EXPANDED HEAD PILLAR FOR BUMP BONDS

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...

ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

Barrier for Power Metallization in Semiconductor Devices

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE

DEVICE WITH PILLAR-SHAPED COMPONENTS

Semiconductor Device with Compressive Interlayer

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

LATERALLY EXTENDED CONDUCTIVE BUMP BUFFER

Compressive Interlayer Having a Defined Crack-Stop Edge Extension

CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...