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H01L2224/85931

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85931by chemical means

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Patents Grantslast 30 patents

Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package with low electromagnetic interference interconnection
- Patent number 9,824,997
- Issue date Nov 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents