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  • CPC
  • H01L2224/80931
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80931by chemical means
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Patents Grantslast 30 patents

  • Information Patent Grant

    MEMS devices and methods of forming same
    • Patent number 8,742,595
    • Issue date Jun 3, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Bruce C. S. Chou
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    MEMS devices and methods of forming same
    • Patent number 8,497,148
    • Issue date Jul 30, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Bruce C. S. Chou
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents