by chemical means

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CPC
H01L2224/83931

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83931by chemical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a back via stack
- Patent number 11,935,908
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Mihye Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,742,319
- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure
- Patent number 11,658,070
- Issue date May 23, 2023
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded die assembly containing a manganese-containing oxide bonding...
- Patent number 11,362,079
- Issue date Jun 14, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,923,465
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including inverted memory stack str...
- Patent number 10,381,362
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,354,985
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 10,141,203
- Issue date Nov 27, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded semiconductor dev...
- Patent number 9,653,438
- Issue date May 16, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20230387373
- Publication date Nov 30, 2023
- Nichia Corporation.
- Hiroki TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220093462
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220084884
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING A BACK VIA STACK
- Publication number 20220028915
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Mihye JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20190273075
- Publication date Sep 5, 2019
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20170365591
- Publication date Dec 21, 2017
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...
- Publication number 20160056136
- Publication date Feb 25, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS

by chemical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode and display apparatus having the same

Image sensor including a back via stack

Method of manufacturing electronic device

Method of forming semiconductor structure

Bonded die assembly containing a manganese-containing oxide bonding...

Semiconductor device having stacked semiconductor chips and method...

Three-dimensional memory device including inverted memory stack str...

Semiconductor device having stacked semiconductor chips and method...

Semiconductor modules with semiconductor dies bonded to a metal foil

Electrical interconnect structure for an embedded electronics package

Electrical interconnect structure for an embedded semiconductor dev...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

IMAGE SENSOR INCLUDING A BACK VIA STACK

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...